Three-dimensional integrated circuits (3-D IC) technology has emerged in the past few
decades, driven in part by the techno-economic difficulties of dimensional scaling and the …

The technology of three-dimensional integrated circuits (3D ICs) has the potential to
diminish the size of packages, decrease interconnect delays, lower energy usage, and …

To solve the increasingly serious thermal management problem of chips with multi-cores
and high power density in the three-dimensional integrated circuit (3D-IC), a model of 3D-IC …

Three-dimensional integrated circuit (3D-IC) technology, which involves the vertical
integration of multiple chips, has effectively reduced the size of electronic devices and …

A three-dimensional integrated circuit (3D-IC) is representative of technologies that have
achieved the “beyond Moore's Law” concept. However, a 3D-IC suffers from the thornier …

A design of microchip cooling with natural convection driven multi-phase coolant flows is
proposed by using thermoelectric modules as heat sinks. A new multi-component multi …

Due to the technological advancements, the three dimensional Integrated Circuits become
the most popular technology. But it has the major drawback of increased time consumption …

A paradigm shift has been witnessed in microelectronic industry in recent days with more
and more research works focusing on transformation of Integrated Circuits from 2 to 3D …

Large datasets in astronomy and geoscience often require clustering and visualizations of
phenomena at different densities and scales in order to generate scientific insight. We …

High-performance computing systems, especially 3D ICs, are yet facing thermal
exacerbation. Inter-tier liquid cooling microchannel layers have been introduced into 3D ICs …