Tribological Design Optimization of Probe Card Tip for Enhanced Chip Manufacturing Productivity
TH Kim, JY Jang, HJ Kim, DE Kim - International Journal of Precision …, 2025 - Springer
Probe testing is performed on all chips during the manufacturing process to ensure quality
control in semiconductor. To enhance productivity in semiconductor manufacturing, it is …
control in semiconductor. To enhance productivity in semiconductor manufacturing, it is …
OEE improvement by pogo pin defect detection in wafer probing process
W Yeo, YC Chang, W Liu - Microsystem Technologies, 2021 - Springer
It is usually very difficult to find the causes of low yield performance in semiconductor
manufacturing. In a typical wafer probing process, when the yield is low, engineers are …
manufacturing. In a typical wafer probing process, when the yield is low, engineers are …
Design of new Au–NiCo MEMS vertical probe for fine-pitch wafer-level probing
XL Le, SH Choa - Crystals, 2021 - mdpi.com
As fine-pitch 3D wafer-level packaging becomes more popular in semiconductor industries,
wafer-level prebond testing of various interconnect structures has become increasingly …
wafer-level prebond testing of various interconnect structures has become increasingly …
Experimental Study of Force Induced by Probe Length Influence on Electrical Contact Resistance of Pillar Bump-Flat Vertical Probe Interaction during Wafer Electrical …
C Hermet, L Favre, S Escoubas… - … on Design, Test and …, 2024 - ieeexplore.ieee.org
In the realm of semiconductor manufacturing, the electrical testing of pillar bump wafers is a
critical step for ensuring device reliability and performance. This case study presents a …
critical step for ensuring device reliability and performance. This case study presents a …