The temperature side channel and heating fault attacks

M Hutter, JM Schmidt - Smart Card Research and Advanced Applications …, 2014 - Springer
In this paper, we present practical results of data leakages of CMOS devices via the
temperature side channel—a side channel that has been widely cited in literature but not …

[KNIHA][B] Distortion in RF power amplifiers

J Vuolevi, T Rahkonen - 2003 - books.google.com
" Distortion in RF Power Amplifiers explains that by minimizing memory effects, it is possible
to use simple linearizers, such as analog predistortion, and still achieve sufficient …

A survey on low-power techniques with emerging technologies: From devices to systems

PE Gaillardon, E Beigne, S Lesecq… - ACM Journal on Emerging …, 2015 - dl.acm.org
Nowadays, power consumption is one of the main limitations of electronic systems. In this
context, novel and emerging devices provide new opportunities to extend the trend toward …

Dynamic surface temperature measurements in ICs

J Altet, W Claeys, S Dilhaire… - Proceedings of the IEEE, 2006 - ieeexplore.ieee.org
Measuring techniques of the die surface temperature in integrated circuits are reported as
very appropriate for failure analysis, for thermal characterization, and for testing modern …

On-chip power monitoring: Leveraging high-sensitivity differential temperature sensors with chopper stabilization and offset calibration

M Yan, T Gourousis, M Onabajo - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
This short introduces a differential temperature sensor that is tailored for on-chip thermal
profiling to monitor the power dissipation of circuits. Chopper stabilization and analog offset …

[KNIHA][B] Digitally assisted pipeline ADCs: theory and implementation

B Murmann, BE Boser - 2004 - books.google.com
Digitally Assisted Pipeline ADCs: Theory and Implementation explores the opportunity to
reduce ADC power dissipation by leveraging digital signal processing capabilities in fine …

[HTML][HTML] Origins of low lattice thermal conductivity in 2D carbon allotropes

H Dong, Z Zhang, Z Feng, J Kang, D Wu… - Journal of Materials …, 2021 - Elsevier
Carbon allotropes occupy significant roles in heat conduction fields. The thermal
transmission in most allotropes is determined by phonons, and ultimately, fundamentally is …

[HTML][HTML] Differential temperature sensors: Review of applications in the test and characterization of circuits, usage and design methodology

E Barajas, X Aragones, D Mateo, J Altet - Sensors, 2019 - mdpi.com
Differential temperature sensors can be placed in integrated circuits to extract a signature of
the power dissipated by the adjacent circuit blocks built in the same silicon die. This review …

Defect-oriented non-intrusive RF test using on-chip temperature sensors

L Abdallah, HG Stratigopoulos, S Mir… - 2013 IEEE 31st VLSI …, 2013 - ieeexplore.ieee.org
We present a built-in, defect-oriented test approach for RF circuits that is based on thermal
monitoring. A defect will change the power dissipation of the circuit under test from its …

On-chip thermal profiling to detect malicious activity: System-level concepts and design of key building blocks

M Yan, H Wei, M Onabajo - IEEE Transactions on Very Large …, 2021 - ieeexplore.ieee.org
This article introduces an on-chip anomaly monitoring system design approach that is based
on thermal profiling and side-channel analysis. The strategy aims at the realization of …