Exponential laws of computing growth
PJ Denning, TG Lewis - Communications of the ACM, 2016 - dl.acm.org
Exponential laws of computing growth Page 1 54 COMMUNICATIONS OF THE ACM | JANUARY
2017 | VOL. 60 | NO. 1 contributed articles ILL US TRA TION B Y PETER CRO W THER A …
2017 | VOL. 60 | NO. 1 contributed articles ILL US TRA TION B Y PETER CRO W THER A …
The N3XT approach to energy-efficient abundant-data computing
The world's appetite for analyzing massive amounts of structured and unstructured data has
grown dramatically. The computational demands of these abundant-data applications, such …
grown dramatically. The computational demands of these abundant-data applications, such …
Design automation and testing of monolithic 3D ICs: Opportunities, challenges, and solutions
Monolithic 3D ICs (M3D) are fabricated using a sequential process that grows new device
and interconnect tiers in a bottom-up fashion. This fabrication process is in contrast to …
and interconnect tiers in a bottom-up fashion. This fabrication process is in contrast to …
Heterogeneous mixed-signal monolithic 3-D in-memory computing using resistive RAM
Resistive random access memory (RRAM)-based compute-in-memory architecture helps
overcome the bottleneck caused by large memory transactions in the convolutional neural …
overcome the bottleneck caused by large memory transactions in the convolutional neural …
Monolithic 3D IC vs. TSV-based 3D IC in 14nm FinFET technology
SK Samal, D Nayak, M Ichihashi… - 2016 IEEE SOI-3D …, 2016 - ieeexplore.ieee.org
In this paper, we conduct a comprehensive design comparison of 2D ICs, monolithic 3D ICs
and TSV-based 3D ICs using a silicon-validated 14nm FinFET foundry technology and …
and TSV-based 3D ICs using a silicon-validated 14nm FinFET foundry technology and …
Mono3D: Open source cell library for monolithic 3-D integrated circuits
Monolithic 3-D (M3-D) integrated circuits (ICs) provide vertical interconnects with
comparable size to on-chip metal vias, and therefore, achieve ultra-high density device …
comparable size to on-chip metal vias, and therefore, achieve ultra-high density device …
Cascade2D: A design-aware partitioning approach to monolithic 3D IC with 2D commercial tools
Monolithic 3D IC (M3D) can continue to improve power, performance, area and cost beyond
traditional Moore's law scaling limitations by leveraging the third-dimension and fine-grained …
traditional Moore's law scaling limitations by leveraging the third-dimension and fine-grained …
Monolithic 3-D integration
The demands of future applications in computing (from self-driving cars to bioinformatics)
overwhelm the projected capabilities of current electronic systems. The need to process …
overwhelm the projected capabilities of current electronic systems. The need to process …
Toward robust cognitive 3d brain-inspired cross-paradigm system
Spiking Neuromorphic systems have been introduced as promising platforms for energy-
efficient spiking neural network (SNNs) execution. SNNs incorporate neuronal and synaptic …
efficient spiking neural network (SNNs) execution. SNNs incorporate neuronal and synaptic …
Performance and thermal tradeoffs for energy-efficient monolithic 3D network-on-chip
Three-dimensional (3D) integration enables the design of high-performance and energy-
efficient network on chip (NoC) architectures as communication backbones for manycore …
efficient network on chip (NoC) architectures as communication backbones for manycore …