Acceleration factors and predictive life models are of use to build-in board assembly
reliability and estimate solder joint life at the design stage. They allow designers to answer …

Thermal fatigue is a major source of failure of solder joints in surface mount electronic
components and it is critically important in high reliability applications such as …

Abstract Eutectic Ag3Sn can grow with a variety of morphologies depending on the
solidification conditions and plays an important role in the performance of Pb-free solders …

The microstructure control and refinement in length scale are pursued in the development of
next generations of Pb-free solder alloys with high reliability in harsh environments. In the …

The solidification of Pb-free solder joints is overviewed with a focus on the formation of the β
Sn grain structure and grain orientations. Three solders commonly used in electronics …

Cu 6 Sn 5 is a common intermetallic in Pb-free soldering. We explore the influence of dilute
aluminium additions on the heterogeneous nucleation and grain refinement of primary Cu 6 …

The strategies for inducing heredity of β-Sn texture and thus controlling β-Sn orientation in
micro solder joints during multi-reflow process were investigated. The temperature gradient …

With the continuous advancement of integrated packaging technology, the dimensions of Sn-
based interconnected joints are being steadily reduced. It is necessary to investigate the …

It is widely accepted that further development of Pb-free solder alloys for improved
processing and in-service properties of next-generation electronics, can be accelerated …

The dependence of the solidification temperature on the concentration x of impurity atoms,
M, of Sn-M x alloys after cooling from the melt was measured separately for M= Co, Ni, Ag …