A wafer-to-wafer bonding structure may include: a first wafer including a first insulating layer
on a first substrate and on a first copper (Cu) pad that penetrates the first insulating layer and …

After forming a stacked nanowire CMOS device including a first stacked nanowire array
laterally surrounded by first epitaxial semiconductor regions, a second stacked nanowire …

Aspects of the disclosure provide a semiconductor device and a method for manufacturing
the semiconductor device. The semiconductor device includes a power rail formed in an …

Abstract Systems and methods described herein are directed to solutions for NoC
interconnects that provide congestion avoidance and end-to-end uniform and weighted-fair …

Abstract Systems and methods described herein are directed to streaming bridge design
implementations that help interconnect and transfer transaction packets between multiple …

A non-volatile memory device includes a substrate, a memory cell array on the substrate, a
plurality of bonding pads, and a pad circuit. The memory cell array includes a plurality of …

GO6F 3/40(2006.01) f lan for a N k on Chi C 1 h GO6F 5/78 (2006.01) oor plan for a Network
on Chip (NoC) topology that can include a plurality of on chip blocks of substantially non …

Example implementations described herein are directed to a system on chip (SoC) that can
include a plurality of blocks of substantially non-uniform shapes and dimensions, a plurality …

The number of components on a chip is rapidly growing due to increasing levels of
integration, System complexity and shrinking transistor geometry. Complex System-on …

Abstract Systems and methods for automatically building a deadlock free inter-
communication network in a multi-core system are described. The example embodiments …