Dummy filling is widely applied to significantly improve the planarity of topographic patterns
for the chemical mechanical polishing process in VLSI manufactures. The main challenge of …

Dummy filling is widely applied to significantly improve the planarity of topographic patterns
for the chemical mechanical polishing (CMP) process in VLSI manufacturing. This paper …

Dummy filling is widely applied to significantly improve the planarity of topographic patterns
for the chemical mechanical polishing (CMP) process in VLSI manufacturing. In the dummy …

The book systematically expounds the main results obtained by the author in the field of
design and optimization of high-speed integrated circuits (ICs) and their standard blocks …

In semiconductor design, challenges posed by the chemical-mechanical polishing (CMP)
process are accentuated by the unintended timing degradation from conventional metal fill …

This chapter is devoted to the development of methods and principles for improving the main
characteristics of digital standard cell (SC), which will allow to significantly increase the …

In the pursuit of advancing integrated circuit design for smaller technology nodes, this paper
introduces an innovative technique called Dummy Metal Fill (DMF). This method addresses …

Routing is a challenging stage of the Integrated Circuit (IC) design process. A routing
algorithm often adopts the two-stage approach of global routing followed by detailed routing …

As dummy metal fill insertion is mandatory step for integrated circuits'(IC) current
manufacturing processes, many works are targeting better fill insertion with small coupling …

Pushing the integrated circuit (IC) technology node to extreme brings in daunting challenges
for the semiconductor manufacturing. The IC fabrication involves a series of physical and …