Cerium oxide nanoparticles (CeNPs) are versatile materials with unique and unusual
properties that vary depending on their surface chemistry, size, shape, coating, oxidation …

As the minimum feature size of integrated circuit elements has shrunk below 7 nm, chemical
mechanical planarization (CMP) technology has grown by leaps and bounds over the past …

Ceria-based abrasive is widely used in the oxide chemical mechanical polishing (CMP)
process due to its high polishing performance. Ce 3+ ions on the surface of ceria form a Ce …

A hybrid siloxane-based coating was modified with CeO 2 nanoparticles and applied on
AZ31. The corrosion protection performance was evaluated via Electrochemical Impedance …

In this work, we synthesized a superhydrophobic self-healing silane hybrid coating based on
benzotriazole (BTA) loaded hollow CeO 2 nano-capsules on copper substrate and …

Along with the remarkable growth in the complexity of semiconductor fabrication technology,
chemical mechanical planarization (CMP) has evolved and become progressively more …

Hollow CeO 2 nanoparticles were prepared and employed as nano-carriers to encapsule
benzotriazole inhibitor. The benzotriazole loaded formulations were co-electrodeposited …

A series of aluminum phosphate ceramic coating with the entrapped ceria (CeO 2)
nanoparticles, which is denoted APC, were constructed by steam-assisted curing method on …

The contamination behavior of ceria particles (50 and 100 nm) with oxide surfaces at pH 4
and 8 was studied using dip** and polishing conditions. Higher contamination at pH 4 …

Layered quasi-triangular Ce (OH) CO3 assembled from primary nanoparticles was
synthesized via a solvothermal method and converted into CeO2 abrasive particles by …