Recent developments in stainless steels
This article presents an overview of the developments in stainless steels made since the
1990s. Some of the new applications that involve the use of stainless steel are also …
1990s. Some of the new applications that involve the use of stainless steel are also …
A state-of-the-art review of fatigue life prediction models for solder joint
Fatigue failure of solder joints is one of the major causes of failure in electronic devices.
Fatigue life prediction models of solder joints were first put forward in the early 1960s, and …
Fatigue life prediction models of solder joints were first put forward in the early 1960s, and …
Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy
Low cycle isothermal mechanical fatigue testing of a eutectic alloy 63Sn/37Pb was carried
out in a systematic manner over a wide range of frequencies (10− 4–1 Hz) and temperatures …
out in a systematic manner over a wide range of frequencies (10− 4–1 Hz) and temperatures …
Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging
HLJ Pang, KH Tan, XQ Shi, ZP Wang - Materials Science and Engineering …, 2001 - Elsevier
Microstructure development of eutectic solder alloy (63Sn/37Pb) after thermal cycling aging
and its impact on the shear and fatigue failure of the solder joint has been investigated. The …
and its impact on the shear and fatigue failure of the solder joint has been investigated. The …
Low cycle fatigue models for lead-free solders
Low cycle fatigue (LCF) tests for 95.5 Sn–3.8 Ag–0.7 Cu and 99.3 Sn–0.7 Cu Pb-free
solders were conducted for two conditions of 25° C at 1 Hz and 125° C at 0.001 Hz. The …
solders were conducted for two conditions of 25° C at 1 Hz and 125° C at 0.001 Hz. The …
Creep and fatigue characterization of lead free 95.5 Sn-3.8 Ag-0.7 Cu solder
The creep and fatigue properties of 95.5 Sn-3.8 Ag-0.7 Cu lead free solders were
investigated. Steady-state creep behavior for 95.5 Sn-3.8 Ag-0.7 Cu bulk solder specimens …
investigated. Steady-state creep behavior for 95.5 Sn-3.8 Ag-0.7 Cu bulk solder specimens …
Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for IGBT power module
Thermal stress in IGBT power module can lead to sever thermal reliability problems such as
module deformation, performance degradation and even permanent damage. So, it is …
module deformation, performance degradation and even permanent damage. So, it is …
Analysis and modeling of aged SAC-Bi solder joints subjected to varying stress cycling conditions
Solder joints are subjected to varied stress cycle circumstances in the electronic packaging
service life but are also influenced by aging. There has been limited investigation into the …
service life but are also influenced by aging. There has been limited investigation into the …
Coupling of phase field and viscoplasticity for modelling cyclic softening and crack growth under fatigue
J Song, LG Zhao, H Qi, S Li, D Shi, J Huang… - European Journal of …, 2022 - Elsevier
A coupled phase field-viscoplasticity approach was developed to model the deformation and
crack growth in a nickel-based superalloy under fatigue. The coupled model has an …
crack growth in a nickel-based superalloy under fatigue. The coupled model has an …
Low cycle fatigue study of lead free 99.3 Sn–0.7 Cu solder alloy
In this paper, low cycle fatigue studies on 99.3 Sn–0.7 Cu lead free solder was evaluated
over a range of test temperatures (298, 348 and 398 K) and frequencies (10− 3–1 Hz) …
over a range of test temperatures (298, 348 and 398 K) and frequencies (10− 3–1 Hz) …