Digital accelerators in the latest generation of complementary metal–oxide–semiconductor
processes support, multiply, and accumulate (MAC) operations at energy efficiencies …

Photonics die or integrated photonics modules co-packaged with compute engines have the
potential to deliver significant improvements in power, bandwidth and reach needed to meet …

Silicon photonics is advancing rapidly in performance and capability with multiple fabrication
facilities and foundries having advanced passive and active devices, including modulators …

In recent years, optical modulators, photodetectors,(de) multiplexers, and heterogeneously
integrated lasers based on silicon optical platforms have been verified. The performance of …

Programmable photonics have the potential to completely transform a range of emerging
applications, including optical computing, optical signal processing, light detecting and …

The relentless growth of Artificial Intelligence (AI) workloads has fueled the drive towards
non-Von Neuman architectures and custom computing hardware. Neuromorphic photonic …

High-bandwidth, low-power and compact silicon electro-optical modulators are essential for
future energy-efficient and densely integrated optical data communication circuits. The all …

This work presents a hybrid-integrated 4-micro-ring modulator-based wavelength-division
multiplexed (WDM) optical transmitter (OTX) in the O-band, suitable for co-packaged optics …

Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter
traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three …

A flip-chip co-packaged linear transimpedance amplifier (TIA) in 16-nm fin field effect
transistor (FinFET) CMOS demonstrating 112-Gb/s four-level pulse-amplitude modulation (4 …