An apparatus includes a needle including a hole extending from a first end to a second end
through the needle and an energy-emitting device arranged in the hole of the needle. The …

An apparatus for transferring a semiconductor die from a wafer tape to a product substrate.
The apparatus includes a wafer frame configured to hold the wafer tape and a support frame …

257/E21. 505 6, 323, 659 B1 11/2001 Krahn 6, 352, 073 B1 3/2002 Kurosawa et al. 6, 353,
202 B1 3/2002 Grotsch et al. 6, 589, 809 B1 7/2003 Koopmans 6, 730, 933 B15/2004 …

An apparatus includes a substrate and a circuit trace having a predetermined pattern
disposed on the substrate. A plural ity of LEDs are connected to the substrate via the circuit …

An apparatus that directly transfers a semiconductor device die from a first substrate to a
second substrate. The semi conductor device die is disposed on the first side of the first …

(57) ABSTRACT A system to transfer an unpackaged die directly from a die holding
substrate to a transfer location on a secondary substrate. The system includes a die …

(57) ABSTRACT A lighting component including a plurality of die transferred to the glass
substrate. The transfer occurs by positioning the glass substrate to face a first surface of a …

An apparatus includes a frame to hold a wafer tape having a first side and a second side. A
plurality of semiconductor device dies are disposed on the first side of the wafer tape. A …

An elongated light circuit includes an elongated circuit trace and a plurality of micro-sized,
unpackaged LEDs disposed sequentially on the circuit trace. A height of the LEDs ranges …

An apparatus for transferring a semiconductor die from a wafer tape to a product substrate.
The apparatus includes a wafer frame configured to secure the wafer tape and a support …