The continuing miniaturization and increasing power density of two-dimensional (2D)
material electronic devices pose a great challenge for effective thermal management, which …

Heat dissipation and thermal management are central challenges in various areas of
science and technology and are critical issues for the majority of nanoelectronic devices. In …

Graphite-related materials are commonly used as fillers in polymers to prepare thermal
interface materials (TIMs) with high thermal conductivity. The thermal contact resistance …

Understanding the physics underlying energy dissipation is necessary for the effective
thermal management of devices based on two-dimensional (2D) materials and requires …

Heat dissipation in next-generation electronics based on two-dimensional (2D) materials is
a critical issue in their development and implementation. A potential bottleneck for heat …

Interfacial thermal conductance (G) is of critical significance to the efficient thermal
management of two-dimensional (2D) material devices. Despite the importance of defects …

Graphene–metal nanocomposites are promising materials to address the heat dissipation
problems in nanoscale electronic and computing devices. A low resistance interface …

Heat dissipation from graphene devices is predominantly limited by heat conduction across
the metal contacts with complex phonon scattering. In this work, the effects of elastic and …

In nano-device applications using two-dimensional (2D) van der Waals materials, a heat
dissipation through nano-scale interfaces can be a critical issue for optimizing device …

Interfacial thermal resistance plays a crucial role in efficient heat dissipation in modern
electronic devices. It is critical to understand the interfacial thermal transport from both …