The reliance on multi/many-core systems to satisfy the high performance requirement of
complex embedded software applications is increasing. This necessitates the need to …

Microprocessor design has recently encountered many constraints such as power, energy,
reliability, and temperature. Among these challenging issues, temperature-related issues …

Plants possess various defense mechanisms to cope with genotoxic and environmental
challenges, with high temperatures posing a significant threat due to global warming. In this …

In this article, we study the problem of how to maximize the throughput of a periodic real-time
system under a given peak temperature constraint. We assume that different tasks in our …

Virtual machine (VM) placement is a key technique for energy optimization in cloud data
centers. Previous work generally focus on how to place the VMs efficiently in servers to …

Multi-/many-core systems are envisioned to satisfy the ever-increasing performance
requirements of complex applications in various domains such as embedded and high …

State-of-the-art mobile platforms are powered by heterogeneous system-on-chips that
integrate multiple CPU cores, a GPU, and many specialized processors. Competitive …

Heterogeneous multiprocessor systems-on-chip (MPSoCs) powering mobile platforms
integrate multiple asymmetric CPU cores, a GPU, and many specialized processors. When …

Several key attributes of a 3D integrated chip structure are analyzed in this work. Critical
features related to the effect of the size of the substrate, heat sink, device layer, through …

As result of technology scaling, single-chip multicore power density increases and its spatial
and temporal workload variation leads to temperature hot-spots, which may cause …