3D monolithic integration

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Extreme ultraviolet lithography and three dimensional integrated circuit—A review

B Wu, A Kumar - Applied Physics Reviews, 2014 - pubs.aip.org
The term 3D IC generally means an IC package having multiple device layers, which is
different with 3D transistor structures such as the FinFET. 3D packaging and 3D integration …
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[HTML][HTML] Wide bandgap semiconductor-based integrated circuits

S Yuvaraja, V Khandelwal, X Tang, X Li - Chip, 2023 - Elsevier
Wide-bandgap semiconductors possess much larger energy bandgaps in comparison to
traditional semiconductors such as silicon, rendering them very promising for applications in …
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Multilevel semiconductor device and structure with memory

Z Or-Bach, JW Han - US Patent 10,515,981, 2019 - Google Patents
US10515981B2 - Multilevel semiconductor device and structure with memory - Google
Patents US10515981B2 - Multilevel semiconductor device and structure with memory …
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Method of forming three dimensional integrated circuit devices using layer transfer technique

Z Or-Bach, D Sekar, B Cronquist, Z Wurman - US Patent 8,642,416, 2014 - Google Patents
US8642416B2 - Method of forming three dimensional integrated circuit devices using layer
transfer technique - Google Patents US8642416B2 - Method of forming three dimensional …
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Semiconductor device and structure

Z Or-Bach, B Cronquist, I Beinglass, JL De Jong… - US Patent …, 2013 - Google Patents
2011-03-25 Assigned to MONOLITHIC 3D INC. reassignment MONOLITHIC 3D INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …
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Method for fabrication of a semiconductor device and structure

Z Or-Bach, DC Sekar, B Cronquist - US Patent 8,557,632, 2013 - Google Patents
US8557632B1 - Method for fabrication of a semiconductor device and structure - Google
Patents US8557632B1 - Method for fabrication of a semiconductor device and structure …
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Semiconductor system and device

Z Or-Bach, D Sekar, B Cronquist, Z Wurman - US Patent 9,219,005, 2015 - Google Patents
US9219005B2 - Semiconductor system and device - Google Patents US9219005B2 -
Semiconductor system and device - Google Patents Semiconductor system and device …
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Integrated circuit device and structure

Z Or-Bach, DC Sekar, B Cronquist - US Patent 9,099,526, 2015 - Google Patents
US9099526B2 - Integrated circuit device and structure - Google Patents US9099526B2 -
Integrated circuit device and structure - Google Patents Integrated circuit device and structure …
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3D semiconductor device and structure

Z Or-Bach, B Cronquist - US Patent 10,840,239, 2020 - Google Patents
H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state
components formed in or on a common substrate including semiconductor components …
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3D integrated circuit with logic

Z Or-Bach, Z Wurman - US Patent 8,492,886, 2013 - Google Patents
Related US Application Data WO PCT/US2008/063483 5, 2008 (63) Continuation-in-part of
application No. 12/706.520, OTHER PUBLICATIONS filed on Feb. 16, 2010, and a …
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