During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

In the quest for viable alternatives to lead-based solders, electronic industries have started
to focus on several potential lead-free solder alloys. After reviewing more than 100 recent …

The study investigated the growth kinetics and rate-controlling processes of intermetallic
layers formed at the interface between Cu and eutectic Sn–Bi alloys with Ag or Ni addition at …

The influences of In element on microstructure and properties of Sn–Bi based lead-free
solder were investigated in this study. With In element addition, the amount of primary Sn …

A novel modified nanoporous bismuth electrode (modified-NPBiE) sensor was prepared by
consecutive procedures which consist of bismuth (Bi) and tin (Sn) electroplating, thermal …

A comparative analysis between the microstructure and the tensile properties of eutectic Sn–
Bi,(Sn–Bi)–0.5 In, and (Sn–Bi)–0.5 Ni solder alloys was conducted, and the shear strengths …

The effects of Cu and Zn additions on microstructures, thermal and mechanical properties of
Sn–Bi-based solder alloy were investigated. Thermal analysis indicated that Cu addition …

In this study, graphene nanosheets (GNSs) with various percentages (0, 0.01, 0.03, 0.05 and
0.1 wt.%) were successfully incorporated into Sn58Bi lead-free solder. The effects of GNSs …

Abstract In this study, Bi, Sb, and Ni were incorporated into Sn3. 0Ag0. 5Cu (SAC305) solder
to enhance its properties. The composite solders SAC305-xBi-2.0 Sb-0.1 Ni (x= 2.5, 3.0, 3.5 …

A comparative analysis of the microstructure and the mechanical properties of the eutectic
Sn58Bi, 0.5 wt% and 1 wt% zinc (Zn)-functionalized Sn58Bi alloys was conducted before …