Due to their superior material properties, wide bandgap (WBG) semiconductors enable the
application of power electronics at higher temperature operation, higher frequencies, and …

SiC devices are promising for outperforming Si counterparts in high-frequency applications
due to its superior material properties. Conventional wirebonded packaging scheme has …

Power modules are the core components of the powertrain of hybrid and battery electric
vehicle (EV) and has a significant impact on system performance and reliability …

Plasma being the fourth and most abundant form of matter extensively exists in the universe
in the inter-galactic regions. It provides an electrically neutral medium of unbound negative …

In this article, a novel fan-out panel-level printed circuit board (PCB)-embedded package for
phase-leg silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) …

Micro-forming combined with field-activated sintering technology, named micro-FAST, is a
novel method to efficiently fabricate metallic or nonmetallic materials with excellent …

In this paper, a novel fan-out panel-level printed circuit board (PCB) embedded package
technology for silicon carbide (SiC) MOSFET power module is presented to address …

In this paper, a high power-density 3D integrated synchronous buck converter with dual side
cooling structure was designed and analyzed. A novel panel-level PCB embedded package …

The authors conducted direct solid-state diffusion bonding of zirconium carbide (ZrC)-
sintered materials with different average grain sizes of 3.5, 7.5 and 35 μm using a spark …

3-D power module structures allow for better cooling and lower parasitic inductances
compared with the classical planar technology. In this paper, we present a 3-D technology …