The surface finish (SF) becomes a part of the solder joint during assembly and improves the
component's reliability. Furthermore, the SF influences the solder joint's reliability by …

The microstructure, mechanical response, and failure behavior of lead-free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …

As an integrated circuit (IC) package, ball grid arrays (BGA) are widely used in various
electronic systems, playing an important role in energy transfer and electrical signal …

Lead free solder materials are used as interconnects in electronic assemblies due to their
relatively high melting temperature, mechanical properties, and thermal cycling reliability, as …

Lead free electronic assemblies are often subjected to thermal cycling during qualification
testing or during actual use. During the dwells at the constant high temperature extreme, the …

Solder joints in electronic packages are frequently exposed to thermal cycling environments
where temperature variations occur from very low to high temperature. These exposures can …

Pb-free solders based on Sn-Ag-Cu are currently applied to electronic devices. This article
investigates the thermomechanical reliability of three different compositions of Pb-free solder …

Solder joints in electronic assemblies are frequently exposed to thermal cycling
environments in their service life or during accelerated life testing where temperature …

Lead free solder materials are widely used as interconnects in electronic assemblies. They
are often subjected to different thermal exposures such as isothermal aging and/or thermal …

Solder joints in electronic assemblies are frequently exposed to thermal cycling
environments in their service life or during accelerated life testing where temperature …