Abstract Development of polymer-based composites with excellent thermal conductivity and
electrical insulation properties is a hot research topic, because more and more electrical …

As electronic devices continue to shrink in size while increasing in power, the generation of
significant waste heat has become a major obstacle to further progress. Effective thermal …

Multifunctional thermal management materials with highly efficient electromagnetic wave
(EMW) absorption performance are urgently required to tackle the heat dissipation and …

As the power density increases in electronic devices, requirements for high-performance
thermal interface materials that can efficiently bridge the heat transport channel between the …

The “solid–liquid” leakage and low thermal conductivity of organic phase change materials
limit their wide range of applications. In this paper, a novel carbon fiber/boron nitride …

Owing to high graphitization degree, polyacrylonitrile (PAN)-based high modulus carbon
fiber (HMCF) can not only be used as the general structural reinforcement for advanced …

With the continuous advancement of electronic devices, there is an urgent need for
advanced thermal interface materials (TIMs) to prevent high-power density electronics from …

This review documents the current possibilities for producing a thermally conductive polymer
or composite material designated for 3D printing, which could be used for the construction of …

With the ever-shrinking characteristic dimension of chips and the increasing of packaging
density, heat dissipation has become the most critical technology challenge for electronic …

Carbon fiber (CF) with a high thermal conductivity (T c) of 1100 W m− 1 K− 1 along its one-
dimensional (1D) direction is considered a promising filler for fabricating high-performance …