Die singulation, also known as wafer dicing, is reviewed in terms of the brief history, critical
challenges, characterization of singulation quality, different singulation technologies and …

Diamond dicing blades are profound cutting tools that find their applications in
semiconductor back-end packaging and assembly processes. To fully appreciate the …

Wafer dicing chip** and blade wear processes in transient and steady stages were
investigated. Dicing blades with two different diamond grit sizes were used to cut wafers. In …

Utilizing FDMS technology to manufacture ultra-thin diamond blades can enhance its
machining performance. In this study, the machinability of ultrathin diamond blades …

Cu-wire overhang bonding process is investigated first by a high-speed camera system. It
was found that the greater impact, rebound, and deflection of overhang die during the Cu …

Raman silicon (Si) lasers based on high-quality-factor photonic crystal nanocavities are very
compact and can operate at excitation powers of less than one microwatt. For the best …

This is the first report on the coating of diamond dicing blades with metallic glass (MG)
coating to reduce chip** when used to cut Si, SiC, sapphire, and patterned sapphire …

In a flip chip package, due to the sharp square chip corner geometry and the loading from
mismatches in the coefficients of thermal expansion between materials in the assembly, a …

For the current wafer sawing process, the wafers in the same lot are inspected at the end of
the entire process. Therefore, a defect, such as chip**, occurs during processing will only …

Overview and emerging challenges in mechanical dicing of silicon wafers Page 1 Overview
and Emerging Challenges in Mechanical Dicing of Silicon Wafers Ganesh VP and Charles …