Microprocessor design has recently encountered many constraints such as power, energy,
reliability, and temperature. Among these challenging issues, temperature-related issues …

Data centers can go green by saving electricity in two major areas: computing and cooling.
Servers in data centers require a constant supply of cold air from on-site cooling …

Technology scaling has caused the feature sizes to shrink continuously, whereas
interconnects, unlike transistors, have not followed the same trend. Designing 3D stack …

3D multicore systems with stacked DRAM have the potential to boost system performance
significantly; however, this performance increase may cause 3D systems to exceed the …

Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D
IC technology, is motivated to achieve lower latency, lower power consumption, and higher …

Several key attributes of a 3D integrated chip structure are analyzed in this work. Critical
features related to the effect of the size of the substrate, heat sink, device layer, through …

While 3-D integrated circuits (ICs) offer many advantages over 2-D ICs, thermal
management challenges remain unresolved. Thermal through-silicon-vias (TTSVs) are …

Chip multiprocessor (CMP) techniques have been implemented in embedded systems due
to tremendous computation requirements. Three-dimension (3D) CMP architecture has been …

In this article, we study the problem of how to maximize the throughput of a periodic real-time
system under a given peak temperature constraint. We assume that different tasks in our …

Hot spots are a major concern in high-end processors as they constrain performance and
limit the lifetime of semiconductor chips. Using embedded thermal sensors, dynamic thermal …