Abstract The Package-on-Package (PoP) technology is an efficient knowhow to increase the
efficiency of electronic components, hence to secure the continuation of the validity of …

There is a growing interest in low temperature soldering, yet the use of low-melting point
alloys for interconnection is often hindered by reliability concerns. Eutectic tin-bismuth (SnBi) …

High density packaging technology reduces the pad size and the number of grains
contained in the pad. When the polycrystalline pad turns into a single crystal pad, the grain …

In realistic applications, the solder joint is continually subjected to thermal-mechanical stress
due to the difference in the coefficient of thermal expansion between the printed circuit board …

A current approach to low-temperature assembly of microelectronics is to solder to SnAgCu
bumped components with eutectic or hypoeutectic SnBi. However, while the resulting hybrid …

For interconnections and packaging of electronics/microelectronics assemblies, the use of
Sn-rich solders, such as Sn–3.5 Ag or Sn3Ag0. 5Cu, has been proven to be a promising …

Purpose This paper aims to investigate the bonding of the photonic integrated circuit (PIC)
chip with the heat sink using the AlNi self-propagating soldering method …

We propose a comprehensive investigation of solder joint reliability that compares eutectic
SnBi BGA interconnections to novel hypoeutectic Sn-Bi interconnections formed using …

The objective of this dissertation is to understand and control major reliability issues arising
from soldering reactions under space confinement in 3-D IC packages. The goal of current …

We propose a novel approach to adopt SLID to low temperature BGA interconnections that
enables both ball attach and card attach at SnBi eutectic reflow temperatures and enables …