The RF community has long been searching for the ideal switch since the birth of
electronics, and it is defined as a device having virtually no insertion loss (Ron= 0 Ω) over a …

This paper presents the design and characterization of compact high-power RF
microelectromechanical system single-pole single-throw (SPST) and single-pole four-throw …

This paper reports a highly reliable electrostatic microelectromechanical systems (MEMS)
relay for high-power switching applications. The main proposal to elevate reliability is to …

This paper presents the microwave characterization of a wafer level packaging approach for
RF MEMS devices, using glass frit as the bonding material. Coplanar waveguide …

This paper presents a novel wafer-level packaging method for shunt, capacitive RF MEMS
switches using BCB as the adhesive interlayer. Fabrication and electrical characteristics of …

We present a comprehensive study on a high reliability RF-MEMS switch with an active
thermal recovery capability to counteract stiction. Applying finite element (FE) simulations we …

This paper presents the first ultra-low-power complementary metal–oxide–semiconductor
(CMOS)-based measurement technique for monitoring the cold-switched dynamic behavior …

This paper describes the architecture of microstrip (MS) interfaced packaging of a coplanar-
waveguide (CPW)-based radio frequency microelectromechanical systems (RF MEMS) …

This paper presents the survey of different packaging schemes of RF MEMS switches for
wireless application. To determine the reliability of RF MEMS switch that tends to fails due to …

This PhD research aims to develop high density piezoelectric RF-MEMS switch arrays to be
integrated in an energy-efficient agile RF transceiver with reconfigurable antenna. According …