This paper reviewed the state-of-art copper pillar technology in flip-chip packaging, driven
by the semiconductor industry's demands for thinner and faster data transmission. This …

Through-hole technology (THT) for the electronic circuits assembly is known for decades
and recently is replaced by surface-mount technology (SMT). However, THT method is still …

This paper investigates the impact of various copper (Cu) pillar bump heights on
temperature distribution, deformation and thermal stress during reflow. The virtual reflow …

One of the most important procedures in the electronics industry is the assembly of
electronic components onto printed circuit boards (PCBs) through the soldering process …

This study explores the impact of structural modifications on the stress distribution and flow
characteristics of a nozzle box in a steam turbine, specifically targeting the components …

Mini wave soldering is a common method for soldering through-hole components on printed
circuit boards (PCB). With PCB design becoming increasingly complex and copper layer …

This paper presents an optimization of pin through hole (PTH) connector in the wave
soldering process; the optimization was performed by using response surface methodology …

Higher functional integration and increased electrical and reliability requirements are
leading to increasingly complex printed circuit board (PCB) designs. Highly integrated PCBs …

This study aims to investigate the influence of a conveyor angle on capillary flow during the
wave soldering process. Finite volume-based simulation is utilized to study the capillary flow …

Solder joint is an important interconnector in surface mount technology (SMT) assembly
process. The real time stress, strain and displacement of the solder joint is difficult to observe …