Underfill flow in flip-chip encapsulation process: a review
The scope of review of this paper focused on the precuring underfilling flow stage of
encapsulation process. A total of 80 related works has been reviewed and being classified …
encapsulation process. A total of 80 related works has been reviewed and being classified …
A review on numerical approach of reflow soldering process for copper pillar technology
This paper reviewed the state-of-art copper pillar technology in flip-chip packaging, driven
by the semiconductor industry's demands for thinner and faster data transmission. This …
by the semiconductor industry's demands for thinner and faster data transmission. This …
Lattice Boltzmann method study of bga bump arrangements on void formation
This paper studies effects of different bump orientations on the void formation using Lattice
Boltzmann method (LBM) based software. Prediction of air void is vital typically at the onset …
Boltzmann method (LBM) based software. Prediction of air void is vital typically at the onset …
Investigations of infrared desktop reflow oven with FPCB substrate during reflow soldering process
This paper presents the study of infrared (IR) reflow oven characteristics for suitable
operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering …
operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering …
Effect of ILU dispensing types for different solder bump arrangements on CUF encapsulation process
Underfill encapsulation play an important role to improve the reliability of flip chip package,
yet the conventional underfill (CUF) encapsulation process is subjected to several …
yet the conventional underfill (CUF) encapsulation process is subjected to several …
A Review of Moldflow and Finite Element Analysis Simulation of Chip Scale Packaging (CSP) for Light Emitting Diode (LED)
LR Ching, MZ Abdullah - Journal of Advanced Research in …, 2022 - semarakilmu.com.my
LED technology has been evolving aggressively in recent years from incandescent bulb
during older days to as small as chip scale package. There is tremendous pressure to stay …
during older days to as small as chip scale package. There is tremendous pressure to stay …
Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material
This paper investigates the impact of various copper (Cu) pillar bump heights on
temperature distribution, deformation and thermal stress during reflow. The virtual reflow …
temperature distribution, deformation and thermal stress during reflow. The virtual reflow …
Effect of scale size, orientation type and dispensing method on void formation in the CUF encapsulation of BGA
Prediction of void occurrence during capillary underfill encapsulation process is vital to
avoid package failure due to incomplete filling during the encapsulation process. Two …
avoid package failure due to incomplete filling during the encapsulation process. Two …
CUF scaling effect on contact angle and threshold pressure
CUF scaling effect on contact angle and threshold pressure | Emerald Insight Books and
journals Case studies Expert Briefings Open Access Publish with us Advanced search CUF …
journals Case studies Expert Briefings Open Access Publish with us Advanced search CUF …
Lattice Boltzmann method of different BGA orientations on I-type dispensing method
This paper studies the three dimensional (3D) simulation of fluid flows through the ball grid
array (BGA) to replicate the real underfill encapsulation process. The effect of different solder …
array (BGA) to replicate the real underfill encapsulation process. The effect of different solder …