A novel approach to copper-nickel bonding was investigated by hybrid transient liquid
phase sintering (TLPS) method. Hybrid bonding material containing copper, nickel, and Sn …

Sustainable energy conversion has motivated researchers to design and develop novel
efficient bifunctional electrocatalysts for water splitting. In this work, we report the facile …

With continued advances in microelectronics, it is anticipated that next-generation
microelectronic assemblies will require a reduction of the flip-chip solder bump pitch to 100 …

The influence of current direction on the Cu-Ni cross-interaction in the Cu/Sn/Ni joint
configuration was investigated in this study. During current stressing, an electric current …

The effects of the joining sequence on the interfacial reactions and substrate dissolution
behaviors in Ni/solder/Cu joints were studied by using 500-μ m (diameter) Sn-3.5 Ag solder …

The diffusion behavior of Cu and Ni atoms undergoing liquid–solid electromigration (LS EM)
was investigated using Cu/Sn/Ni interconnects under a current density of 5.0× 10 3 A/cm 2 at …

We examined the effects of layers of intermetallic compound (IMC) Ni 3 Sn 4 and (Cu, Ni) 6
Sn 5 formed at the solder/Ni interface, on the cross-interactions between Pd and Ni during …

Abstract The reaction within Ni/Sn/Cu microjoints has been investigated with a 10 μ m initial
thickness of Sn so that Sn was quickly consumed in the early stage of the reaction …

In this study, 96.5 Sn–3.0 Ag–0.5 Cu solder balls were joined to Au/Ni–P/Cu pads by a
thermal reflow process. The interface reactions, solderablity and mechanical reliability of the …

Purpose Solder bumps for chip interconnections are downsizing from current approximately
100 µm to the expected 1 µm in future. As a result, the Cu-Ni cross-interaction in …