Three-dimensional integrated circuits (3-D IC) technology has emerged in the past few
decades, driven in part by the techno-economic difficulties of dimensional scaling and the …

Vertically integrated circuits (3-D ICs) may revitalize Moore's law scaling which has slowed
down in recent years. 3-D stacking is an emerging technology that stacks multiple dies …

We propose efficient algorithms to construct a low-power clock tree for through-silicon-via
(TSV)-based 3D-ICs. We use shutdown gates to save clock trees' dynamic power, which …

Today, electronic devices have been widely deployed in our daily lives, basic infrastructure
such as financial and communication systems, and military systems. Over the past decade …

Abstract Three-dimensional (3D) integration technology is promising to continuously
improve the performance of electronic devices by vertically stacking multiple active layers …

As the semiconductor industry struggles to maintain its momentum down the path following
the Moore's Law, three dimensional integrated circuit (3D IC) technology has emerged as a …