Effect of adhesive layer properties on the shear strength of single-lap structures of dissimilar materials based on the cohesive zone model
J Huang, J Zeng, Y Bai, Z Cheng, Y Wang… - Journal of Mechanical …, 2021 - Springer
An analysis method for improving the shear strength for the single-lap joints of dissimilar
materials based on the cohesive zone model (CZM) is presented in this paper. The shear …
materials based on the cohesive zone model (CZM) is presented in this paper. The shear …
Characterisation of Sn–3.5 Ag solder/Cu joint under various reflow conditions
The effect of reflow time and reflow temperatures on wettability and bond shear strength of
Sn–3.5 Ag solder alloy on a Cu substrate is assessed for reflow times of 10 s, 100 s, 300 s …
Sn–3.5 Ag solder alloy on a Cu substrate is assessed for reflow times of 10 s, 100 s, 300 s …
Effects of Multiple Impacts on the Microstructure and Dynamic Mechanical Properties of SAC0307 Alloy
X Niu, M An, X Li, W Li, X Zhang, Y Wang - Journal of Materials …, 2022 - Springer
Electronic products often suffer from impact loadings and fall during use, resulting in internal
solder joints that interact with each other under a high strain rate. Increasing the number of …
solder joints that interact with each other under a high strain rate. Increasing the number of …
The Effect of Reflow Temperature on Time at the End of Gravity Zone (Tgz) of Sn-3.8Ag-0.7Cu Solder Alloy
RS Panikar, VA Skanda… - Materials …, 2020 - asmedigitalcollection.asme.org
The reflow time for solder until the end of the gravity zone (Tgz) is considered to be the
optimum reflow time for obtaining high mechanical performance from lead-free solders. In …
optimum reflow time for obtaining high mechanical performance from lead-free solders. In …