Thermal management has been playing an important role in electronic encapsulation
because large heat fluxes need to be dissipated from high density/high-power integrated …

Electrically conductive adhesives (ECAs) are widely utilized in various electronic packaging
applications including die fitting, solderless interconnections, component renovation, display …

This paper provides a state-of-the-art review on adhesively bonded joints (ABJs) for
composite materials and structures, with a focus on the open literatures from 2016 to 2023 to …

This article is designed to review the developments in synthesis, modifications, and
properties of epoxy monomers derived from both petroleum and renewable resources. It …

The natural world abounds in lignocellulosic biomass, which is an environmentally friendly
renewable resource. Cellulose nanofibrils (CNFs) made from biomass have the advantages …

Nanotechnology is gaining tremendous impetus due to its capability of modulating metals
into their nanosize, which drastically changes the chemical, physical and optical properties …

Conductive polymer composites (CPCs) containing nanoscale conductive fillers have been
widely studied for their potential use in various applications. In this paper, polypyrrole …

The possibility of obtaining relatively high dielectric constant polymer–ceramic composite by
incorporating the giant dielectric constant material, CaCu3Ti4O12 (CCTO) in a Poly …

The aggregation of nanoparticles has been shown to significantly reduce the activity of
nanomaterials, resulting in inferior performance. As an alternative to the use of traditional …

Fibril or particulate fillers used to reinforce polymeric composites are often inorganic, so, as
two dissimilar materials cannot compatibilize with each other, the problem of adherence …