Wafer bonding with intermediate polymer adhesives is an important fabrication technique for
advanced microelectronic and microelectromechanical systems, such as three-dimensional …

After two decades of intensive development, 3-D integration has proven invaluable for
allowing integrated circuits to adhere to Moore's Law without needing to continuously shrink …

This paper presents a comprehensive review of the reliability issues hampering capacitive
RF MEMS switches in their development toward commercialization. Dielectric charging and …

InGaAs PIN photodetectors heterogeneously integrated on silicon-on-insulator waveguides
are fabricated and characterized. Efficient evanescent coupling between silicon-on-insulator …

Planar array antennas are attractive for use in future automotive radar systems due to their
flexibility in design and control of radar beams. The complexity and cost of a radar front-end …

Ultraviolet light-emitting diodes (UV-LEDs) have drawn considerable attention in
environment, life science, and industry fields, such as the applications of near UV-LEDs in …

In this paper a wafer-level process is proposed to fully integrate carbon-based micro-
supercapacitor onto silicon substrate. This process relies on the deposition of a paste …

Vacuum and hermetic packaging is a critical requirement for optimal performance of many
micro-electromechanical systems (MEMS), vacuum electronics, and quantum devices …

Surface micromachined metal armatures are commonly used for MEMS applications of
which RF-MEMS is the most well known. In most cases metals with a high conductivity, such …

In this paper, we report on a technology for wafer-level MEMS packaging with vertical via
holes and low temperature bonding using a patternable B stage epoxy. We fabricated via …