Effective thermal management is critical for optimising device performance, extending
product longevity, saving energy, protecting the environment, and avoiding thermal failures …

Heat sinks that cool electronic systems through flow boiling are exposed to working fluids at
different inlet temperature. Therefore, in the present study, influence of inlet temperature on …

Flow boiling technology is considered one of the most promising cooling solutions for high
power microelectronics. However, flow boiling instabilities cause serious reliability problems …

In practice, heat sinks are sometimes exposed to sudden and irregular or highly variable
heat loads. Therefore, here, for expanding micro-pin-fin heat sinks having micro cavities …

Flow boiling in microchannels shows high potential to cope with the high power density
dissipation for electronic devices. However, it is a challenge to promote the heat transfer …

In this paper, nine Microchannel Heat sinks (MCHs) all with channel lengths of 20 mm and
heights of 1 mm but with different aspect ratios 1.33; 2 and 4, wall thicknesses 0.25–0.75 …

A thorough understanding of the governing interfacial interactions during flow boiling in a
microchannel would provide important insights into the underlying physics of fluid dynamics …

The increasing prevalence of high-performance computing data centers necessitates the
adoption of cutting-edge cooling technologies to ensure the safe and reliable operation of …

Critical heat flux (CHF) represents heat transfer limit for a heat sink working under flow
boiling conditions. In the literature, for the first time, in micro-pin-fin heat sinks with …

Pin fins have been widely applied in microchannels to enhance the heat transfer
performance, however, they inevitably lead to a large increase in the pressure drop and the …