[HTML][HTML] Printed circuit board embedded power semiconductors: A technology review
T Huesgen - Power Electronic Devices and Components, 2022 - Elsevier
Embedding power semiconductor devices into printed circuit boards (PCB) provides several
benefits compared to conventional packaging technologies. Integrating the semiconductor …
benefits compared to conventional packaging technologies. Integrating the semiconductor …
A highly integrated PCB embedded GaN full-bridge module with ultralow parasitic inductance
Z Qi, Y Pei, L Wang, Q Yang… - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
To fully take the high-frequency advantage of gallium nitride (GaN) devices, this article
presents a face-up integrated power module based on the printed circuit board embedding …
presents a face-up integrated power module based on the printed circuit board embedding …
A high power density double-side-end double-sided bonding SiC half-bridge power module
Y Yan, C Chen, Z Wu, J Guan, J Lv… - IEEE Transactions on …, 2022 - ieeexplore.ieee.org
Silicon carbide (SiC) power module with lower loop inductance, better dynamic current
sharing properties, and better thermal performance will contribute to achieve high power …
sharing properties, and better thermal performance will contribute to achieve high power …
Planar SiC Power Module Packaging and Interconnections Using Direct Ink Writing
Traditional device packaging becomes a limiting factor in realizing the full performance
potential of SiC. Thus, improved and advanced packaging technologies are required to …
potential of SiC. Thus, improved and advanced packaging technologies are required to …
Electromagnetic analysis of switching cells with dies embedded in printed circuit boards: Application to TAPIR (compacT and modulAr Power modules with IntegRated …
The TAPIR technology (compacT and modulAr Power modules with IntegRated cooling)
requires a multiphysics analysis to prove its interest compared to current power module …
requires a multiphysics analysis to prove its interest compared to current power module …
A PCB-Embedded 1.2 kV SiC MOSFET Package with Reduced Manufacturing Complexity
This article presents a printed circuit board (PCB)-embedded 1.2 kV silicon carbide (SiC)
metal-oxide-semiconductor field-effect transistor (MOSFET) half-bridge package for a 22 kW …
metal-oxide-semiconductor field-effect transistor (MOSFET) half-bridge package for a 22 kW …
SiC Power Module Packaging Using Printed Electronics Materials and Processes
Advanced packaging solutions for wide bandgap power devices, such as silicon carbide
(SiC) MOSFETs, can help realize their full potential. Additively printed electronics present a …
(SiC) MOSFETs, can help realize their full potential. Additively printed electronics present a …
Contribution à l'interconnexion de composants actifs intégrés dans des substrats laminés: apport des interfaces micro ou nano-structurées
B Djuric - 2020 - theses.hal.science
Les convertisseurs de puissance occupent une place importante dans l'ingénierie des
systèmes électriques. Les puissances nominales augmentent et les convertisseurs statiques …
systèmes électriques. Les puissances nominales augmentent et les convertisseurs statiques …
Conception et implémentation technologique de convertisseurs de puissance à partir d'un packaging 3D avec refroidissement intégré
W Bikinga - 2022 - theses.hal.science
Pour réussir la transition énergétique, les convertisseurs statiques doivent répondre à
plusieurs problématiques comme l'amélioration du rendement, la réduction des …
plusieurs problématiques comme l'amélioration du rendement, la réduction des …