AlGaN/GaN HEMTs-an overview of device operation and applications

UK Mishra, P Parikh, YF Wu - Proceedings of the IEEE, 2002 - ieeexplore.ieee.org
Wide bandgap semiconductors are extremely attractive for the gamut of power electronics
applications from power conditioning to microwave transmitters for communications and …

A review of GaN on SiC high electron-mobility power transistors and MMICs

RS Pengelly, SM Wood, JW Milligan… - IEEE Transactions …, 2012 - ieeexplore.ieee.org
Gallium-nitride power transistor (GaN HEMT) and integrated circuit technologies have
matured dramatically over the last few years, and many hundreds of thousands of devices …

GaN technology for power electronic applications: A review

TJ Flack, BN Pushpakaran, SB Bayne - Journal of Electronic Materials, 2016 - Springer
Power semiconductor devices based on silicon (Si) are quickly approaching their limits, set
by fundamental material properties. In order to address these limitations, new materials for …

An assessment of wide bandgap semiconductors for power devices

JL Hudgins, GS Simin, E Santi… - IEEE Transactions on …, 2003 - ieeexplore.ieee.org
An advantage for some wide bandgap materials, that is often overlooked, is that the thermal
coefficient of expansion (CTE) is better matched to the ceramics in use for packaging …

AlGaN/AlN/GaN high-power microwave HEMT

L Shen, S Heikman, B Moran, R Coffie… - IEEE Electron …, 2001 - ieeexplore.ieee.org
In this letter, a novel heterojunction AlGaN/AlN/GaN high-electron mobility transistor (HEMT)
is discussed. Contrary to normal HEMTs, the insertion of the very thin AlN interfacial layer …

Diamond as the heat spreader for the thermal dissipation of GaN-based electronic devices

L Sang - Functional Diamond, 2022 - Taylor & Francis
With the increasing power density and reduced size of the GaN-based electronic power
converters, the heat dissipation in the devices becomes the key issue toward the real …

[BOOK][B] Heteroepitaxy of semiconductors: theory, growth, and characterization

JE Ayers, T Kujofsa, P Rago, J Raphael - 2016 - taylorfrancis.com
In the past ten years, heteroepitaxy has continued to increase in importance with the
explosive growth of the electronics industry and the development of a myriad of …

Gate leakage mechanisms in AlGaN/GaN and AlInN/GaN HEMTs: comparison and modeling

S Turuvekere, N Karumuri, AA Rahman… - … on electron devices, 2013 - ieeexplore.ieee.org
The gate leakage mechanisms in AlInN/GaN and AlGaN/GaN high electron mobility
transistors (HEMTs) are compared using temperature-dependent gate current-voltage (I GV …

Present status and future prospect of widegap semiconductor high-power devices

H Okumura - Japanese journal of applied physics, 2006 - iopscience.iop.org
High-power device technology is a key technological factor for wireless communication,
which is one of the information network infrastructures in the 21st century, as well as power …

Measurement of temperature in active high-power AlGaN/GaN HFETs using Raman spectroscopy

M Kuball, JM Hayes, MJ Uren, I Martin… - IEEE Electron …, 2002 - ieeexplore.ieee.org
We report on the noninvasive measurement of temperature, ie, self-heating effects, in active
AlGaN/GaN HFETs grown on sapphire and SiC substrates. Micro-Raman spectroscopy was …