Interface-hydroxyl enabling methanol steam reforming toward CO-free hydrogen production over inverse ZrO2/Cu catalyst

X Xu, T Lan, G Zhao, Q Nie, F Jiang, Y Lu - Applied Catalysis B …, 2023 - Elsevier
Methanol steam reforming (MSR), as an ideal on-site hydrogen production process, is
urgently calling for a groundbreaking catalyst with ultralow or even no CO formation. Herein …

Probing neck growth mechanisms and tensile properties of sintered multi-nanoparticle Al-Cu systems via MD simulation

A Abedini, A Malti, A Kardani, A Montazeri - Advanced Powder Technology, 2023 - Elsevier
In the present work, a series of molecular dynamics simulations are conducted to figure out
how sintering parameters would influence the atomic structure, sintering mechanisms, and …

Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding

JJ Jhan, K Wataya, H Nishikawa, CM Chen - Journal of the Taiwan Institute …, 2022 - Elsevier
Abstract Background Cu-Cu direct bonding is a promising technology to construct a
temperature resistant bonding structure for emerging power devices and vehicle electronics …

Atomic-level sintering mechanism of silica aerogels at high temperatures: Structure evolution and solid thermal conductivity

MY Yang, GH Tang, Q Sheng, L Guo… - International Journal of …, 2022 - Elsevier
Silica aerogels are extensively used for thermal insulation at high temperatures. However, it
has been experimentally found that high temperature can change the pore structure and …

Influence of diamond parameters on microstructure and properties of copper-based diamond composites manufactured by Fused Deposition Modeling and Sintering …

T He, S Zhang, X Kong, J Wu, L Liu, D Wu… - Journal of Alloys and …, 2023 - Elsevier
As an additive manufacturing technology, Fused Deposition Modeling and Sintering (FDMS)
technology can give diamond tools some creative structures to be applied in more fields. To …

When mechanisms of coalescence and sintering at the nanoscale fundamentally differ: Molecular dynamics study

VM Samsonov, IV Talyzin, VV Puytov… - The Journal of …, 2022 - pubs.aip.org
Employing classical isothermal molecular dynamics, we simulated coalescence of
mesoscopic Au nanodroplets, containing from several thousands to several hundred …

[HTML][HTML] Mechanical characterizations of η′-Cu6 (Sn, In) 5 intermetallic compound solder joint: getting prepared for future nanobumps

X Mao, Y An, Y Chen, G Zheng, R Hou, X Zhang… - Journal of Materials …, 2024 - Elsevier
As advanced silicon manufacturing processes slow down in scaling, three-dimensional
stacking of chips has become a future trend in microelectronic industry. High-density …

Tens-of-seconds solid-state sinter-bonding technique in air using in situ reduction of surface oxide layers on easily bendable dendritic Cu particles

EB Choi, JH Lee - Applied Surface Science, 2022 - Elsevier
Solid-state sinter bonding using metal particles, such as Ag and Cu, are emerging for the
development of the next-generation die-attachment technique of a semiconductor chip that …

SLM printing of cermet powders: Inhomogeneity from atomic scale to microstructure

M ** ultra-high-density interconnects using current technologies presents certain
limitations. It is because traditional solder joint technology employs a liquid-solid interfacial …