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Interface-hydroxyl enabling methanol steam reforming toward CO-free hydrogen production over inverse ZrO2/Cu catalyst
X Xu, T Lan, G Zhao, Q Nie, F Jiang, Y Lu - Applied Catalysis B …, 2023 - Elsevier
Methanol steam reforming (MSR), as an ideal on-site hydrogen production process, is
urgently calling for a groundbreaking catalyst with ultralow or even no CO formation. Herein …
urgently calling for a groundbreaking catalyst with ultralow or even no CO formation. Herein …
Probing neck growth mechanisms and tensile properties of sintered multi-nanoparticle Al-Cu systems via MD simulation
In the present work, a series of molecular dynamics simulations are conducted to figure out
how sintering parameters would influence the atomic structure, sintering mechanisms, and …
how sintering parameters would influence the atomic structure, sintering mechanisms, and …
Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding
JJ Jhan, K Wataya, H Nishikawa, CM Chen - Journal of the Taiwan Institute …, 2022 - Elsevier
Abstract Background Cu-Cu direct bonding is a promising technology to construct a
temperature resistant bonding structure for emerging power devices and vehicle electronics …
temperature resistant bonding structure for emerging power devices and vehicle electronics …
Atomic-level sintering mechanism of silica aerogels at high temperatures: Structure evolution and solid thermal conductivity
Silica aerogels are extensively used for thermal insulation at high temperatures. However, it
has been experimentally found that high temperature can change the pore structure and …
has been experimentally found that high temperature can change the pore structure and …
Influence of diamond parameters on microstructure and properties of copper-based diamond composites manufactured by Fused Deposition Modeling and Sintering …
T He, S Zhang, X Kong, J Wu, L Liu, D Wu… - Journal of Alloys and …, 2023 - Elsevier
As an additive manufacturing technology, Fused Deposition Modeling and Sintering (FDMS)
technology can give diamond tools some creative structures to be applied in more fields. To …
technology can give diamond tools some creative structures to be applied in more fields. To …
When mechanisms of coalescence and sintering at the nanoscale fundamentally differ: Molecular dynamics study
VM Samsonov, IV Talyzin, VV Puytov… - The Journal of …, 2022 - pubs.aip.org
Employing classical isothermal molecular dynamics, we simulated coalescence of
mesoscopic Au nanodroplets, containing from several thousands to several hundred …
mesoscopic Au nanodroplets, containing from several thousands to several hundred …
[HTML][HTML] Mechanical characterizations of η′-Cu6 (Sn, In) 5 intermetallic compound solder joint: getting prepared for future nanobumps
X Mao, Y An, Y Chen, G Zheng, R Hou, X Zhang… - Journal of Materials …, 2024 - Elsevier
As advanced silicon manufacturing processes slow down in scaling, three-dimensional
stacking of chips has become a future trend in microelectronic industry. High-density …
stacking of chips has become a future trend in microelectronic industry. High-density …
Tens-of-seconds solid-state sinter-bonding technique in air using in situ reduction of surface oxide layers on easily bendable dendritic Cu particles
EB Choi, JH Lee - Applied Surface Science, 2022 - Elsevier
Solid-state sinter bonding using metal particles, such as Ag and Cu, are emerging for the
development of the next-generation die-attachment technique of a semiconductor chip that …
development of the next-generation die-attachment technique of a semiconductor chip that …
SLM printing of cermet powders: Inhomogeneity from atomic scale to microstructure
M ** ultra-high-density interconnects using current technologies presents certain
limitations. It is because traditional solder joint technology employs a liquid-solid interfacial …
limitations. It is because traditional solder joint technology employs a liquid-solid interfacial …