Structure and properties of lead-free solders bearing micro and nano particles
L Zhang, KN Tu - Materials Science and Engineering: R: Reports, 2014 - Elsevier
Composite lead-free solders, containing micro and nano particles, have been widely
studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder …
studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder …
Properties and Microstructures of Sn‐Ag‐Cu‐X Lead‐Free Solder Joints in Electronic Packaging
L Sun, L Zhang - Advances in Materials Science and …, 2015 - Wiley Online Library
SnAgCu solder alloys were considered as one of the most popular lead‐free solders
because of its good reliability and mechanical properties. However, there are also many …
because of its good reliability and mechanical properties. However, there are also many …
[HTML][HTML] Microstructural and shear strength properties of GNSs-reinforced Sn-1.0 Ag-0.5 Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface …
In this study, the combined effect of GNSs (graphene nanosheets) and ENIAg (Electroless
Nickel Immersion Silver) surface finish on the formation of intermetallic compounds (IMCs) …
Nickel Immersion Silver) surface finish on the formation of intermetallic compounds (IMCs) …
The role of intermetallic compounds in controlling the microstructural, physical and mechanical properties of Cu-[Sn-Ag-Cu-Bi]-Cu solder joints
Abstract A lead-free Sn-2.5 Ag-0.7 Cu base solder with different weight percentages of
bismuth (0, 1, 2.5, 5) was used. Thermal properties, microstructure, wettability and …
bismuth (0, 1, 2.5, 5) was used. Thermal properties, microstructure, wettability and …
Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin–bismuth (Sn–Bi) solder
AK Gain, L Zhang - Journal of Materials Science: Materials in Electronics, 2016 - Springer
This paper investigates the effects of Ni nanoparticles on the formation of intermetallic
compound (IMC) layers and mechanical properties of low melting temperature Sn–58Bi …
compound (IMC) layers and mechanical properties of low melting temperature Sn–58Bi …
Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions
Nanocomposite lead-free solders are gaining prominence as replacements for conventional
lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are …
lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are …
Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5 Ag–0.7 Cu low-Ag solder alloys for electronic applications
AE Hammad - Materials & Design (1980-2015), 2013 - Elsevier
For development of lead-free solder for advance electrical components, the correlation of
microstructure with thermal and creep properties of novel Ni-doped Sn–0.5 Ag–0.7 Cu (SAC …
microstructure with thermal and creep properties of novel Ni-doped Sn–0.5 Ag–0.7 Cu (SAC …
Impact of different isothermal aging conditions on the IMC layer growth and shear strength of MWCNT-reinforced Sn–5Sb solder composites on Cu substrate
In this study, the effect of multi-walled carbon nanotubes (MWCNTs) reinforcement on the
intermetallic compound (IMC) layer growth and shear strength of Sn–5Sb-xCNT/Cu …
intermetallic compound (IMC) layer growth and shear strength of Sn–5Sb-xCNT/Cu …
Coupling effects of rare-earth Pr and Al2O3 nanoparticles on the microstructure and properties of Sn-0.3 Ag-0.7 Cu low-Ag solder
J Wu, S Xue, J Wang, M Wu - Journal of Alloys and Compounds, 2019 - Elsevier
Low-cost Al 2 O 3 nanoparticles (NPs) are regularly incorporated into lead-free solder to
improve its mechanical performance, but the poor wettability of Al 2 O 3 NPs leads to weak …
improve its mechanical performance, but the poor wettability of Al 2 O 3 NPs leads to weak …
Review on microstructure evolution in Sn–Ag–Cu solders and its effect on mechanical integrity of solder joints
The use of Pb-bearing solders in electronic assemblies is avoided in many countries due to
the inherent toxicity and environmental risks associated with lead. Although a number of “Pb …
the inherent toxicity and environmental risks associated with lead. Although a number of “Pb …