Numerical simulation of materials-oriented ultra-precision diamond cutting: review and outlook

L Zhao, J Zhang, J Zhang, H Dai… - … Journal of Extreme …, 2023‏ - iopscience.iop.org
Ultra-precision diamond cutting is a promising machining technique for realizing ultra-
smooth surface of different kinds of materials. While fundamental understanding of the …

A review of the research on the variation of tool's motion trajectory and its influence on the formation mechanism of surface quality in ultrasonic vibration machining

G Gu, S Wu, D Wang, S Zhou, L Zhu, Q An… - Journal of Manufacturing …, 2023‏ - Elsevier
Compared to traditional machining, ultrasonic vibration machining harnesses the power of
small yet high-frequency vibrations to generate distinctive relative displacements between …

Effects of tool geometry on tungsten removal behavior during nano-cutting

H Wang, Z Dong, S Yuan, X Guo, R Kang… - International Journal of …, 2022‏ - Elsevier
Although the researches in effects of tool geometry on the removal behavior of many metals
have been studied, the deformation and removal mechanisms of tungsten have changed …

Molecular dynamics simulations in semiconductor material processing: A comprehensive review

Y Yun, S Wu, D Wang, X Luo, J Chen, G Wang… - Measurement, 2024‏ - Elsevier
Molecular dynamics (MD) simulations have become a pivotal tool in the nanofabrication of
semiconductor materials, a key area of contemporary semiconductor process research. This …

Molecular dynamics simulation studies of properties, preparation, and performance of silicon carbide materials: a review

Z Yan, R Liu, B Liu, Y Shao, M Liu - Energies, 2023‏ - mdpi.com
Silicon carbide (SiC) materials are widely applied in the field of nuclear materials and
semiconductor materials due to their excellent radiation resistance, thermal conductivity …

Molecular dynamics simulation on crystal defects of single-crystal silicon during elliptical vibration cutting

C Liu, S To, X Sheng, J Xu - International Journal of Mechanical Sciences, 2023‏ - Elsevier
In recent years, elliptical vibration cutting (EVC) has become a promising technique to
fabricate high quality surface of single-crystal silicon. However, our understanding for its …

Effect of vibration parameters on the material removal characteristics of high-entropy alloy in scratching

DQ Doan, TH Fang - International Journal of Mechanical Sciences, 2022‏ - Elsevier
Although vibration-assisted scratching achieves higher machining efficiency than
conventional scratching, its microstructural behavior is still unclear. In the present work, the …

Numerical investigation on subsurface damage in nanometric cutting of single-crystal silicon at elevated temperatures

C Liu, X Chen, J Ke, Z She, J Zhang, J **ao… - Journal of Manufacturing …, 2021‏ - Elsevier
Achieving nanometric surface on single-crystal silicon is important for semiconductor and
optoelectronics industries. In recent years, thermal assisted machining (hot machining) …

[HTML][HTML] Predictive modelling for enhanced scratching of brittle ceramics with magneto-plasticity

Y Guo, J Zhan, YJ Lee, WF Lu, H Wang - International Journal of …, 2023‏ - Elsevier
The micro-cutting of brittle ceramics starts with elastic-plastic deformation followed by severe
brittle fracture, which significantly restricts the machinability and application of these …

Microstructure evolution mechanism of tungsten induced by ultrasonic elliptical vibration cutting at atomic/nano scale

H Wang, R Kang, Y Bao, K Wang, X Guo… - International Journal of …, 2023‏ - Elsevier
Ultrasonic elliptical vibration cutting (UEVC) technology has been utilized for ultra-precision
machining of difficult-to-machine metal materials such as tungsten. Nevertheless, the …