Heat transfer and fluid flow in microchannels have been topics of intense research in the
past decade. A critical review of the current state of research is presented with a focus on the …

Three-dimensional (3D) integrated circuits (ICs), which contain multiple layers of active
devices, have the potential to dramatically enhance chip performance, functionality, and …

Three-dimensional integrated circuits (3-D IC) technology has emerged in the past few
decades, driven in part by the techno-economic difficulties of dimensional scaling and the …

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more
than twice as much new content, adding the latest developments in circuit models …

2011-12-06 Assigned to MONOLITHIC 3D INC. reassignment MONOLITHIC 3D INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …

3D monolithic integration, thanks to its high vertical density of interconnections, is the only
available option for applications requiring connections at the transistor scale. However to …

3-D technology provides many benefits including high density, high bandwidth, low-power,
and small form-factor. Through Silicon Via (TSV), which provides communication links for …

The critical operation needed to achieve monolithic three-dimensional integrated circuits is
obtaining single-crystal, device-quality semiconductor material for upper layer active circuits …

3D integration is the stacking of multiple active device layers (with or without interconnecting
metal lines) to form a more complex integrated circuit or to provide a new architectural …

Recent breakthroughs in brain-inspired computing promise to address a wide range of
problems from security to healthcare. However, the current strategy of implementing artificial …