Heat transfer in microchannels—2012 status and research needs
Heat transfer and fluid flow in microchannels have been topics of intense research in the
past decade. A critical review of the current state of research is presented with a focus on the …
past decade. A critical review of the current state of research is presented with a focus on the …
Three-dimensional integrated circuits
Three-dimensional (3D) integrated circuits (ICs), which contain multiple layers of active
devices, have the potential to dramatically enhance chip performance, functionality, and …
devices, have the potential to dramatically enhance chip performance, functionality, and …
[書籍][B] Three-dimensional integrated circuit design
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more
than twice as much new content, adding the latest developments in circuit models …
than twice as much new content, adding the latest developments in circuit models …
Method of constructing a semiconductor device and structure
Z Or-Bach, DC Sekar, B Cronquist, I Beinglass… - US Patent …, 2012 - Google Patents
2011-12-06 Assigned to MONOLITHIC 3D INC. reassignment MONOLITHIC 3D INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …
3D monolithic integration
P Batude, M Vinet, A Pouydebasque… - … of Circuits and …, 2011 - ieeexplore.ieee.org
3D monolithic integration, thanks to its high vertical density of interconnections, is the only
available option for applications requiring connections at the transistor scale. However to …
available option for applications requiring connections at the transistor scale. However to …
TSV redundancy: Architecture and design issues in 3-D IC
AC Hsieh, TT Hwang - IEEE Transactions on Very Large Scale …, 2011 - ieeexplore.ieee.org
3-D technology provides many benefits including high density, high bandwidth, low-power,
and small form-factor. Through Silicon Via (TSV), which provides communication links for …
and small form-factor. Through Silicon Via (TSV), which provides communication links for …
Two-Dimensional Materials for Brain-Inspired Computing Hardware
Recent breakthroughs in brain-inspired computing promise to address a wide range of
problems from security to healthcare. However, the current strategy of implementing artificial …
problems from security to healthcare. However, the current strategy of implementing artificial …
Semiconductor crystal islands for three-dimensional integration
F Crnogorac, S Wong, RFW Pease - Journal of Vacuum Science & …, 2010 - pubs.aip.org
The critical operation needed to achieve monolithic three-dimensional integrated circuits is
obtaining single-crystal, device-quality semiconductor material for upper layer active circuits …
obtaining single-crystal, device-quality semiconductor material for upper layer active circuits …
A review of recent research on heat transfer in three-dimensional integrated circuits (3-D ICs)
Three-dimensional integrated circuits (3-D IC) technology has emerged in the past few
decades, driven in part by the techno-economic difficulties of dimensional scaling and the …
decades, driven in part by the techno-economic difficulties of dimensional scaling and the …
Overlay as the key to drive wafer scale 3D integration
3D integration is the stacking of multiple active device layers (with or without interconnecting
metal lines) to form a more complex integrated circuit or to provide a new architectural …
metal lines) to form a more complex integrated circuit or to provide a new architectural …