Inkjet-printed flexible sensors: From function materials, manufacture process, and applications perspective

X Wang, M Zhang, L Zhang, J Xu, X **ao… - Materials Today …, 2022‏ - Elsevier
Recently, novel functional ink materials and printing technologies confer sensors to
increasing novel features and facilitate their better integration with wearable, health …

Pressure induced nanoparticle phase behavior, property, and applications

F Bai, K Bian, X Huang, Z Wang, H Fan - Chemical reviews, 2019‏ - ACS Publications
Nanoparticle (NP) high pressure behavior has been extensively studied over the years. In
this review, we summarize recent progress on the studies of pressure induced NP phase …

[HTML][HTML] Sustainable production of highly conductive multilayer graphene ink for wireless connectivity and IoT applications

K Pan, Y Fan, T Leng, J Li, Z **n, J Zhang, L Hao… - Nature …, 2018‏ - nature.com
Printed electronics offer a breakthrough in the penetration of information technology into
everyday life. The possibility of printing electronic circuits will further promote the spread of …

Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices

S Wünscher, R Abbel, J Perelaer… - Journal of Materials …, 2014‏ - pubs.rsc.org
Well-defined high resolution structures with excellent electrical conductivities are key
components of almost every electronic device. Producing these by printing metal based …

Silver nanoparticles based ink with moderate sintering in flexible and printed electronics

L Mo, Z Guo, L Yang, Q Zhang, Y Fang, Z **n… - International journal of …, 2019‏ - mdpi.com
Printed electronics on flexible substrates has attracted tremendous research interest
research thanks its low cost, large area production capability and environmentally friendly …

Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air

Z Zhang, C Chen, Y Yang, H Zhang, D Kim… - Journal of Alloys and …, 2019‏ - Elsevier
Sinter joining with Ag particle paste has emerged as a promising lead-free die-attachment
solution for power devices owing to its low-temperature and pressureless processing …

Inkjet‐printed flexible gold electrode arrays for bioelectronic interfaces

Y Khan, FJ Pavinatto, MC Lin, A Liao… - Advanced Functional …, 2016‏ - Wiley Online Library
Bioelectronic interfaces require electrodes that are mechanically flexible and chemically
inert. Flexibility allows pristine electrode contact to skin and tissue, and chemical inertness …

Alternative sintering methods compared to conventional thermal sintering for inkjet printed silver nanoparticle ink

J Niittynen, R Abbel, M Mäntysalo, J Perelaer… - Thin Solid Films, 2014‏ - Elsevier
In this contribution several alternative sintering methods are compared to traditional thermal
sintering as high temperature and long process time of thermal sintering are increasing the …

Microstructure evolution during 300 C storage of sintered Ag nanoparticles on Ag and Au substrates

SA Paknejad, G Dumas, G West, G Lewis… - Journal of Alloys and …, 2014‏ - Elsevier
A silver nanoparticle based die attach material was used in a pressure free process to bond
2.5 mm square Ag plated Si die to Ag and Au plated substrates. The assemblies were stored …

Silver ink formulations for sinter-free printing of conductive films

K Black, J Singh, D Mehta, S Sung, CJ Sutcliffe… - Scientific reports, 2016‏ - nature.com
Inkjet printing offers an attractive method for the deposition of metal interconnects in
electronic systems and enables a low-cost, environmentally friendly route to manufacture …