The electronic equipment develo** towards miniaturization and high integration is facing
the danger of high heat flux and non-uniform temperature distribution which leads to the …

Heat removal from high heat flux devices such as computer chips, laser diodes, and other
electronic devices and components has been a significant issue with the advances in micro …

Numerical study has been carried out to examine the heat transfer and fluid flow
characteristics of open microchannel heat sinks consist of square pin fins. Variation of fin …

Two-phase internal flow is ubiquitous to many systems due to its ability to transfer large
amounts of heat effectively. Recent advances motivated by sustainability have pushed …

The present trend of miniaturization in various electronic devices has caused higher heat
generation per unit area. Dissipation of highly concentrated heat from these devices is …

Microchannel heat sink without any tip clearance ie completely closed microchannels have
been focused and widely studied. In the present work, detailed comparative analysis has …

Temperature non-uniformity on chips has drawn the attention of researchers due to
unwanted thermal stress development on chips resulting in a reduction in their life cycle and …

To solve the increasingly serious thermal management problem of chips with multi-cores
and high power density in the three-dimensional integrated circuit (3D-IC), a model of 3D-IC …

In the present work, three-dimensional numerical investigation has been carried out to
comprehend the thermohydraulic performance of novel design of double-layer microchannel …

This paper investigates the hydrodynamic and thermal characteristics of perforated micro pin-
fin (MPF) heat sink with different shapes and numbers of perforations under a low range …