High aspect ratio (HAR) silicon etch is reviewed, including commonly used terms, history,
main applications, different technological methods, critical challenges, and main theories of …

Over the past four decades, the field of silicon piezoresistive pressure sensors has
undergone a major revolution in terms of design methodology and fabrication processes …

Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a
comprehensive guide to MEMS materials, technologies, and manufacturing with a particular …

Mid‐infrared materials antireflection is in high demand for high‐powered or ultra‐broadband
coherent light sources, where conventional antireflection coatings cannot be reliably …

This chapter discusses reactive ion etching (RIE) and deep RIE (DRIE) on wafers detailing
the various equipment and reactor requirements for different applications. The Bosch …

The search for alternatives to the standard methods of preventing bacterial adhesion and
biofilm formation on biotic and abiotic surfaces alike has led to the use of biomimetics to …

Silicon devices are ubiquitous in many micro-and nano-scale technological applications,
most notably microelectronics and microelectromechanical systems (MEMS). Despite their …

An introduction to the exciting and continuously growing topic of IC packaging is presented
herein. This review starts with a beginner's level introduction to microelectronic packaging …