As semiconductor device scaling faces a severe technical bottleneck, vertical die stacking
technologies have been developed to obtain high performance, high density, low latency …

The thermal expansion of copper pads within dielectric vias plays a crucial role during
hybrid bonding. In this paper, we tailored the thermal expansion of Cu pads by modifying the …

We present a modeling framework to guide the development and optimization of the hybrid
bonding process. The key challenge is to achieve fully-bonded Cu-Cu metal interfaces/pads …

Hybrid bonding is a key technology for realizing three-dimensional integrated circuit (3D IC)
packaging. This process utilizes the coefficient of thermal expansion (CTE) mismatch …

Hybrid bonding has become a promising solution to next generation of high-performance 3D
integration packaging technology with an advanced development of material process …

With the advancement in the fine-pitch packaging< 10µm and the requirement of
heterogeneous integration, chip-to-wafer (C2W) hybrid bonding is widely explored for future …

Recently, 3D hybrid bonding has drawn a lot of interest since it is an essential technology for
system scaling by increasing interconnect density. However, 3D stacked structures face …

Atomistic modelling is used to study a variety of material properties, many of which are
important for hybrid bonding technology. We created a computational platform, referred to as …

This paper addresses the key requirements for a successful Die-to-Wafer hybrid bonding
process for die stacking. The paper delves into requirements, principles, challenges, and …

The pursuit of higher packing density has propelled the shift towards three-dimensional (3D)
integrated circuits (3D-ICs), promising heightened performance, accelerated data speeds …