As to promote the performance of the solder joints applied to electronics industry, the
researchers take advantage of micro/nano-sized particles or another element coated on …

The electronic industry faces a number of issues as a result of the rapid miniaturization of
electronic products and the expansion of application areas, with the reliability of electronic …

Abstract The mechanical mixed Sn58Bi solder reinforced by B 4 C nanoparticles for the
interconnect of Cu/Cu same metal was studied. The hardness of solder alloy and shear …

Abstract Package-on-Package (PoP) is a popular technology for fabricating chipsets of
accelerated processing units. However, the coefficient of thermal expansion mismatch …

In recent years, in order to adapt to the trend of low-temperature assembly and integration,
low-temperature hybrid solders with multiple elements added to the tin solder matrix have …

The development of hybrid solder for chip packing is a major 3D packaging research topic.
The incorporation of with low melting points into solder materials has been used in low …

To alleviate the problem of residual stress in silica glass/2024Al soldered joints, ultrasonic-
assisted soldering of silicon glass and 2024Al was carried out using Sn single bond Bi low …

The preparation of new solder joint materials for chip packaging by designing a variety of
brazing material mixes has become one of the future research directions for solder joints …

Due to the development of advanced packaging technology such as Package on Package
(POP), traditional Sn-Ag-Cu (SAC) solder can no longer meet the demand. Utilizing the …

With the ongoing advancements and innovations of electronic device, the demand for low-
melting-point solder is rising, especially for flexible printed electronics. The service …