Voltage‐and Metal‐assisted Chemical Etching of Micro and Nano Structures in Silicon: A Comprehensive Review

S Surdo, G Barillaro - Small, 2024 - Wiley Online Library
Sculpting silicon at the micro and nano scales has been game‐changing to mold bulk silicon
properties and expand, in turn, applications of silicon beyond electronics, namely, in …

[HTML][HTML] Proton beam writing

F Watt, MBH Breese, AA Bettiol, JA van Kan - Materials today, 2007 - Elsevier
Proton beam (p-beam) writing is a new direct-writing process that uses a focused beam of
MeV protons to pattern resist material at nanodimensions. The process, although similar in …

[Књига][B] Porous silicon in practice: preparation, characterization and applications

MJ Sailor - 2012 - books.google.com
By means of electrochemical treatment, crystalline silicon can be permeated with tiny,
nanostructured pores that entirely change the characteristics and properties of the material …

Silicon nanostructures for molecular sensing: a review

VS Vendamani, SVSN Rao, AP Pathak… - ACS Applied Nano …, 2022 - ACS Publications
This review presents a comprehensive synopsis of the recent developments and
achievements in the research of nanosensors composed of plasmonic nanoparticles (NPs) …

[Књига][B] Radiation defect engineering

K Vitali, V Abrosimova - 2005 - books.google.com
The increasing complexity of problems in semiconductor electronics and optoelectronics has
exposed the insufficient potential of the technological do** processes currently used. One …

Proton beam writing: a progress review

JA Van Kan, AA Bettiol, K Ansari… - International …, 2004 - inderscienceonline.com
A new direct write 3D nano lithographic technique has been developed at the Centre for Ion
Beam Applications (CIBA) in the Physics Department of the National University of …

3D Free‐Form Patterning of Silicon by Ion Implantation, Silicon Deposition, and Selective Silicon Etching

AC Fischer, LM Belova, YGM Rikers… - Advanced Functional …, 2012 - Wiley Online Library
A method for additive layer‐by‐layer fabrication of arbitrarily shaped 3D silicon micro‐and
nanostructures is reported. The fabrication is based on alternating steps of chemical vapor …

Hole transport through proton-irradiated -type silicon wafers during electrochemical anodization

MBH Breese, FJT Champeaux, EJ Teo, AA Bettiol… - Physical Review B …, 2006 - APS
The hole current density flowing through and around proton-irradiated areas of p-type silicon
during electrochemical anodization is simulated and studied experimentally using scanning …

Toward the formation of three-dimensional nanostructures by electrochemical etching of silicon

P Kleimann, X Badel, J Linnros - Applied Physics Letters, 2005 - pubs.aip.org
We report a simple technique to form various kinds of three-dimensional structures in silicon.
The process flow is only composed of two steps: lithography and electrochemical etching …

Lithography of high spatial density biosensor structures with sub-100 nm spacing by MeVproton beam writing with minimal proximity effect

HJ Whitlow, ML Ng, V Auželyté, I Maximov… - …, 2003 - iopscience.iop.org
Metal electrode structures for biosensors with a high spatial density and nm gaps have been
produced using focused megaelectronvolt (MeV) proton beam writing of poly-(methyl …