Al2O3 nanofibers reinforced Sn58Bi/SAC 305 hybrid joints for low temperature ball grid array bonding
SH Rajendran, JH Ku, J Kang, JP Jung - Materials Today Communications, 2024 - Elsevier
In the artificial intelligence (AI) era, adopting low-temperature soldering technology serves
the dual purpose of meeting carbon-neutral demands and mitigating warpage issues in …
the dual purpose of meeting carbon-neutral demands and mitigating warpage issues in …
Investigation of bonding properties of solderable anisotropic polymer composite filled with low-and high-melting-point alloy fillers
YH Ha, JI Lee, JM Kim, BS Yim - Journal of Materials Science: Materials in …, 2024 - Springer
The bonding properties of solderable anisotropic polymer composites (SAPCs) containing
only low-melting-point alloy (LMPA) fillers need improvement. In this study, a new composite …
only low-melting-point alloy (LMPA) fillers need improvement. In this study, a new composite …
Investigation of interconnection properties of solderable isotropic polymer composite filled with low-and high-melting-point solder mixed fillers
MJ Ha, JI Lee, JM Kim, BS Yim - Journal of Materials Science: Materials in …, 2023 - Springer
A novel low-melting-point solder (LMS) and high-melting-point solder (HMS)-filled
solderable isotropic polymer composite (LH-SIPC) was developed to enhance the …
solderable isotropic polymer composite (LH-SIPC) was developed to enhance the …
Effect of relative humidity on corrosion behavior of SAC305 and Sn–37Pb solders under polyvinyl chloride fire smoke atmosphere
Q Li, J Lin, C Li, S Lu, X Chen - Journal of Materials Science: Materials in …, 2020 - Springer
The effect of ambient relative humidity from 50 to 98% on the corrosion characteristics of
SAC305 and Sn–37Pb solders under the polyvinyl chloride fire smoke atmosphere was …
SAC305 and Sn–37Pb solders under the polyvinyl chloride fire smoke atmosphere was …
Cause analysis on the unqualified pull-out force between the bushing and PCB pad in DC-DC converters for new energy vehicles
J Chen, ZG Yang - Engineering Failure Analysis, 2023 - Elsevier
For new energy vehicles, the DC-DC converter is a key component to realize the electricity
conversion between different voltage networks. In the DC-DC converter described in this …
conversion between different voltage networks. In the DC-DC converter described in this …
Enabling Socketable BGAs with Eutectic-Forming Bi-based Coatings on Sn Spheres: A Closer Look at the Bi Deposition Process
J Lee, V Smet - 2024 IEEE 74th Electronic Components and …, 2024 - ieeexplore.ieee.org
Land grid arrays (LGAs) and ball grid arrays (BGAs) are prevalent technologies for the board-
level interconnection of numerous packaged integrated circuits (ICs). These technologies …
level interconnection of numerous packaged integrated circuits (ICs). These technologies …
[HTML][HTML] Conduction Path Formation Characteristics of Solderable Polymer Composite Filled with Low-Melting-Point and High-Melting-Point Alloy Fillers
민정하， 지호김， 재구한， 진석양， 종민김… - Journal of Welding and …, 2022 - e-jwj.org
In this study, low-melting-point alloy (LMPA) and high-melting-point alloy (HMPA) filler-filled
solderable polymer composite (LH-SPC) system was proposed to enhance the mechanical …
solderable polymer composite (LH-SPC) system was proposed to enhance the mechanical …
Mechanisms for the formation of conduction paths in a solderable epoxy composite with a mixed low-and high-melting-point solder filler
MJ Ha, JI Lee, JM Kim, BS Yim - Journal of Materials Science: Materials in …, 2023 - Springer
A novel bonding system for a solderable epoxy composite (SEC) containing a mixed low-
melting-point solder (LMS) and high-melting-point solder (HMS) filler (LH-SEC) was …
melting-point solder (LMS) and high-melting-point solder (HMS) filler (LH-SEC) was …