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Investigation of bonding properties of solderable anisotropic polymer composite filled with low-and high-melting-point alloy fillers
YH Ha, JI Lee, JM Kim, BS Yim - Journal of Materials Science: Materials in …, 2024 - Springer
The bonding properties of solderable anisotropic polymer composites (SAPCs) containing
only low-melting-point alloy (LMPA) fillers need improvement. In this study, a new composite …
only low-melting-point alloy (LMPA) fillers need improvement. In this study, a new composite …
Mechanisms for the formation of conduction paths in a solderable epoxy composite with a mixed low-and high-melting-point solder filler
MJ Ha, JI Lee, JM Kim, BS Yim - Journal of Materials Science: Materials in …, 2023 - Springer
A novel bonding system for a solderable epoxy composite (SEC) containing a mixed low-
melting-point solder (LMS) and high-melting-point solder (HMS) filler (LH-SEC) was …
melting-point solder (LMS) and high-melting-point solder (HMS) filler (LH-SEC) was …
Al2O3 nanofibers reinforced Sn58Bi/SAC 305 hybrid joints for low temperature ball grid array bonding
SH Rajendran, JH Ku, J Kang, JP Jung - Materials Today Communications, 2024 - Elsevier
In the artificial intelligence (AI) era, adopting low-temperature soldering technology serves
the dual purpose of meeting carbon-neutral demands and mitigating warpage issues in …
the dual purpose of meeting carbon-neutral demands and mitigating warpage issues in …
Enabling Socketable BGAs with Eutectic-Forming Bi-based Coatings on Sn Spheres: A Closer Look at the Bi Deposition Process
J Lee, V Smet - 2024 IEEE 74th Electronic Components and …, 2024 - ieeexplore.ieee.org
Land grid arrays (LGAs) and ball grid arrays (BGAs) are prevalent technologies for the board-
level interconnection of numerous packaged integrated circuits (ICs). These technologies …
level interconnection of numerous packaged integrated circuits (ICs). These technologies …
Cause analysis on the unqualified pull-out force between the bushing and PCB pad in DC-DC converters for new energy vehicles
J Chen, ZG Yang - Engineering Failure Analysis, 2023 - Elsevier
For new energy vehicles, the DC-DC converter is a key component to realize the electricity
conversion between different voltage networks. In the DC-DC converter described in this …
conversion between different voltage networks. In the DC-DC converter described in this …
Effect of relative humidity on corrosion behavior of SAC305 and Sn–37Pb solders under polyvinyl chloride fire smoke atmosphere
Q Li, J Lin, C Li, S Lu, X Chen - Journal of Materials Science: Materials in …, 2020 - Springer
The effect of ambient relative humidity from 50 to 98% on the corrosion characteristics of
SAC305 and Sn–37Pb solders under the polyvinyl chloride fire smoke atmosphere was …
SAC305 and Sn–37Pb solders under the polyvinyl chloride fire smoke atmosphere was …
Investigation of interconnection properties of solderable isotropic polymer composite filled with low-and high-melting-point solder mixed fillers
MJ Ha, JI Lee, JM Kim, BS Yim - Journal of Materials Science: Materials in …, 2023 - Springer
A novel low-melting-point solder (LMS) and high-melting-point solder (HMS)-filled
solderable isotropic polymer composite (LH-SIPC) was developed to enhance the …
solderable isotropic polymer composite (LH-SIPC) was developed to enhance the …
Conduction Path Formation Characteristics of Solderable Polymer Composite Filled with Low-Melting-Point and High-Melting-Point Alloy Fillers
하민정， 김지호， 한재구， 양진석， 김종민… - 대한용접접합 …, 2022 - scholarworks.bwise.kr
In this study, low-melting-point alloy (LMPA) and high-melting-point alloy (HMPA) filler-filled
solderable polymer composite (LH-SPC) system was proposed to enhance the mechanical …
solderable polymer composite (LH-SPC) system was proposed to enhance the mechanical …
先进封装 Cu-Sn 互连焊点界面 金属间化合物研究进展.
陈** - Micronanoelectronic Technology, 2024 - search.ebscohost.com
对先进封装中Cu-Sn 焊点之间的界面金属间化合物(IMC) 形成机理与生长控制进行阐述,
分别从Cu-Sn 焊点界面之间增加阻挡层与锡焊点内部掺杂合金元素两个方面介绍了Cu-Sn …
分别从Cu-Sn 焊点界面之间增加阻挡层与锡焊点内部掺杂合金元素两个方面介绍了Cu-Sn …
[PDF][PDF] 저융점/고융점 합금 입자 함유 Solderable 고분자 복합 소재의 도전 경로 형성 특성
하민정， 김지호， 한재구， 양진석， 김종민， 임병승 - 대한용접· 접합학회지, 2022 - e-jwj.org
In this study, low-melting-point alloy (LMPA) and high-melting-point alloy (HMPA) filler-filled
solderable polymer composite (LH-SPC) system was proposed to enhance the mechanical …
solderable polymer composite (LH-SPC) system was proposed to enhance the mechanical …