The internet of things and growing demand for smaller and more advanced devices has
created the problem of high heat production in electronic equipment, which greatly reduces …

Copper/diamond composites have drawn lots of attention in the last few decades, due to its
potential high thermal conductivity and promising applications in high-power electronic …

Abstract Cu/55 vol% diamond (Ti) composites are prepared by hot forging of cold-pressed
powder preforms, consisted of pure Cu powders and 50 nm-thick Ti-coated diamond …

To unravel the underlying causes of the opposite variation tendency in theoretical and
experimental thermal conductivity of copper/diamond composites as the increasing …

Abstract Cu–Cr/55 vol% diamond composites with 1 wt%(Cu–1Cr/55Dia), 2 wt%(Cu–
2Cr/55Dia), and 3 wt%(Cu–3Cr/55Dia) Cr additives, respectively, are fabricated by a hot …

With the increasing demand for thermal management materials in the highly integrated
electronic area, high thermal conductive polymer composites are of great significance …

Manipulating the interfacial structure is vital to enhancing the interfacial thermal
conductance (G) in Cu/diamond composites for promising thermal management …

Copper matrix composites reinforced with 60 vol% diamond particles were prepared by
pressure infiltration using Cu-Cr alloy with 0.3–1.0 wt% Cr. The x-ray diffraction, scanning …

To overcome the drawback of weak interface bonding in diamond particles reinforced Cu
matrix (Cu/diamond) composites, we prepared the Cu/Zr-diamond composites via a gas …

ABSTRACT Metal-matrix composites (MMCs), especially the novel carbon materials such as
graphene (Gr), carbon nanotubes (CNTs) and diamond, reinforced MMCs, have received …