Owing to its outstanding mechanical properties, γ-TiAl is desirable materials for cross-
generation aero-engines. Nearly 70 years of exploration have made it into the initial …

Ultra-precision diamond cutting is a promising machining technique for realizing ultra-
smooth surface of different kinds of materials. While fundamental understanding of the …

Difficult-to-machine materials (DMMs) are extensively applied in critical fields such as
aviation, semiconductor, biomedicine, and other key fields due to their excellent material …

The critical grinding depth of ductile-brittle transition is an important processing parameter to
guarantee brittle materials machining in ductile mode. Nevertheless, it is a difficult task to …

Ductile-regime grinding has been used to eliminate the formation of subsurface cracks by
setting an extremely small depth of cut (DOC). The critical DOC is affected by multiple …

Reaction-bonded silicon carbide (RB-SiC) is an important material used in aerospace
optical systems. Due to the property mismatch between Si and SiC phases, the underlying …

The ultra-precision grinding technology based on a workpiece self-rotational principle is
extensively used for silicon wafer thinning in the chip post-processing. Nevertheless, owing …

In recent years, elliptical vibration cutting (EVC) has become a promising technique to
fabricate high quality surface of single-crystal silicon. However, our understanding for its …

Abstract While SiCp/Al composites are widely used in engineering applications owing to
their excellent material properties, the traditional machining of SiCp/Al composites remains …

The chip generation and removal characteristic of SiC in thermal-assisted nano-abrasion
are investigated using molecular dynamics simulation. Varieties of minimum uncut chip …