Increasing power densities in future technology nodes is a crucial issue in multicore
platforms. As the number of cores increases in them, power budget constraints may prevent …

Multicore platforms offer great potential for task-level redundancy to achieve a degree of
fault-tolerance/reliability in embedded systems by exploiting the idle cores. However, due to …

Tackling the dark silicon problem in a heterogeneous multicore system, the temperature
constraints across the system should be addressed carefully by assigning a proper set of …

One of the cost-efficient fabrication approaches for connecting layers in three-dimensional
integrated circuits (3D ICs) is the use of through-silicon vias (TSVs). However, the large and …

Low power consumption and high-reliability are often major objectives in the design of
embedded systems. To reduce power consumption, embedded systems usually employ …

Occurring crosstalk fault between wires is among the significant reliability challenges in
transferring data between Processing Elements (PEs). Crosstalk fault occurs due to inter …

Recently proposed crosstalk avoidance coding mechanisms (CACs) are not able to prevent
inductance effects. For solving this problem, an efficient numerical-based CAC mechanism …

An efficient numeral-based coding mechanism, called SDT-free is proposed in this paper
that avoids crosstalk faults. The SDT-free coding mechanism completely removes bit …

Migration to Three Dimensional Integrated Circuits (3D ICs) can provide higher scalability,
higher throughput, and lower power consumption with respect to Two Dimensional …

Abstract Hierarchical architecture of Wireless Network on Chips (WNoCs) composes of
wired level and wireless level. In this architecture, subnetworks in wired level are connected …