Interfacial thermal resistance is the primary impediment to heat flow in materials and devices
as characteristic lengths become comparable to the mean‐free paths of the energy carriers …

The coupled interactions among the fundamental carriers of charge, heat, and
electromagnetic fields at interfaces and boundaries give rise to energetic processes that …

As the features of microprocessors are miniaturized, low-dielectric-constant (low-k) materials
are necessary to limit electronic crosstalk, charge build-up, and signal propagation delay …

Aluminum nitride (AlN) is one of the few electrically insulating materials with excellent
thermal conductivity, but high-quality films typically require exceedingly hot deposition …

Brain-inspired neuromorphic computing emulates the biological functions of the human
brain to achieve highly intensive data processing with low power consumption. In particular …

The electrodeposition of low surface area lithium is critical to successful adoption of lithium
metal batteries. Here, we discover the dependence of lithium metal morphology on electrical …

Aluminum nitride (AlN) plays a key role in modern power electronics and deep-ultraviolet
photonics, where an understanding of its thermal properties is essential. Here, we measure …

Phase change memory (PCM) is a rapidly growing technology that not only offers
advancements in storage-class memories but also enables in-memory data processing to …

The need for increased control of layer thickness and uniformity as device dimensions shrink
has spurred increased use of atomic layer deposition (ALD) for thin film growth. The ability to …

We use a multi-scale modeling to study the time-dependent dielectric breakdown of an
amorphous (a-) HfO 2 insulator in a metal–oxide–metal capacitor. We focus on the role …