During soldering and service, intermetallic compounds (IMCs) have an important impact on
the performance and reliability of electronic products. A thin and continuous intermetallic …

Due to the inherent toxicity of lead (Pb), environmental regulations around the world have
been targeted to eliminate the usage of Pb-bearing solders in electronic assemblies. This …

The effects of alloy composition on microstructural, especially the formation of large
intermetallic compounds, and mechanical properties of various Sn–Ag–Cu solder joints …

The interfacial reactions between Sn-based solders and two common substrate materials,
Cu and Ni, are the focuses of this paper. The reactions between Sn-based solders and Cu …

The effects of the fourth elements, ie, Fe, Ni, Co, Mn and Ti, on microstructural features,
undercooling characteristics, and monotonic tensile properties of Sn–3 wt.% Ag–0.5 wt …

The objective of this review is to study the interfacial intermatallic compounds (IMCs)
between Sn–Ag–Cu based solders and common substrates, which play a crucial role in …

Many intermetallics, such as Ag3Sn, AuSn4, Cu3Sn, Cu6Sn5 (η and η), Ni3Sn4, and γ–
Cu5Zn8 are present in modern solder interconnects as a result of solder chemistry and/or …

In the present study, varying weight percentages of carbon nanotubes (CNTs) were
incorporated into Sn–Ag–Cu solder matrix, to form composite solders. Isothermal aging …

Abstract Replacing Pb-Sn with Pb-free solders is one of the most important issues in the
electronic industry. Melting, dissolution, solidification and interfacial reactions are …

Abstract Solders based on Sn-Ag alloys are susceptible to microstructural coarsening during
storage or service, resulting in evolution of joint properties, and hence reliability, over time …